What does IC chip tape refer to? Selection of component packaging mode
Date:2021-11-12 11:15:46Views:3057
IC, that is, integrated circuit, uses semiconductor manufacturing process to make many transistors, resistors, capacitors and other components on a small monocrystalline silicon chip, and combine the components into a complete electronic circuit according to the method of multi-layer wiring or tunnel wiring. In the circuit, it is represented by the letter "IC" (also with the word symbol "n", etc.). What is IC chip tape? Put the electronic components together with something like a belt. Reel the tape on a disc. This is IC braiding.
Tape braiding is a process in small capacitors. Before gold spraying, tape the core into a disc with adhesive tape paper, and protect the side of the core, so that the gold spraying will not spray on the side of the core and will not cause short circuit. There is also a finished tape braiding process for small plastic shell capacitors and small plastic encapsulated capacitors, that is, the capacitors are braided one by one onto a paper tape and wound up for packaging and preservation. The equipment used is braiding machine, which is also called braiding packaging machine and winding packaging machine. It is mainly used for packaging SMD materials, led, inductance, resistance and other reel packaging. Braided packaging is a new type of packaging. Machines are mainly divided into three categories: fully automatic, semi-automatic and electric. The materials used by the tape braiding machine include: upper cover tape, carrier tape, reel, adaptive components: resistance, diode, color code inductance, transistor, fuse, aluminum electrolytic capacitor, triode, LED / light emitting, such as resistance. Generally, there are two packaging methods for resistance. One is tape braiding, which is to arrange the resistance in a row and connect it with tape. The other is bulk, that is, the resistance is independent of each other. Pack in boxes or bags.
What is the emphasis on the packaging mode of component logistics? Let's have a look!
1. Tape packing
In the chip specification book, it is generally reel, which means tape braiding, commonly known as reel packaging, which is the most common packaging method in SMT, because SMT adopts automatic equipment and needs to be put on the machine material rack to achieve the purpose of automatic chip placement, and tape is the most commonly used specification. It can be said that more than 90% of the patch materials are braided packaging, which can achieve the best degree of automatic production. Of course, many goods can only be made into braiding mode, which is generally our best choice.
2. Pallet packaging
For some IC chips, especially QFP \ TQFP \ BGA (when the number of pins is more than 48), because the size becomes larger, the general packaging form of this kind of chips is tray, and generally there is not much choice. In order to ensure that the IC pins are not deformed, the tape packaging may not be suitable for QFP TQFP, so it may be beneficial to protect the pins in the form of tray.
For some TQFP chips with small feet and small size, there are both tape braiding and pallet packaging. At this time, we still prefer tape braiding. Because of the large size of tray packaging in SMT, the number of packages is relatively small. After unpacking, each tray must be checked to confirm that the pins are deformed, and then the whole unpacking, inspection, insertion and other operations are all manual operations, which will be touched by hands, which will have a great chance to have an adverse impact on chip pins and falling.
3. Tube assembly
This is not recommended. Tube assembly is a magical existence. SMT and chip have developed for so many years, depending on a large number of tube assemblies, or even only tube assemblies. For such 8-pin, 16 pin and 20 pin SOP chips, tube packaging and tape packaging almost coexist. Considering that the manufacturer's packaging method is distinguished by material number, both have choices and can be used according to the actual situation.
At present, the biggest problem of the pipe packaging method is that our factory can't directly patch, the effect is not good, and the process is unstable, which will also affect the efficiency. Therefore, there is no mainstream cost in the industry. Therefore, the current practice is to pour out the chip in the pipe and reinstall it on the drag tray to simulate the second operation mentioned above. Imagine that thousands of chips are poured out of the tube and placed in the tray. First of all, the cost of customizing the tray is not to mention, the workload of chip placement is very large, and there is also a quality hidden danger. In this process, there are a series of problems, such as the risk of deformation of chip pins, the risk of reverse placement, and so on. At this point, you may understand how much impact this kind of IC will have if it is tube assembly. Therefore, when cutting the material number, we should check whether there is a tape number in the specification book, and choose tape packaging as far as possible.
4. Bulk material
This is a last resort. Needless to say, bulk materials can only be operated manually on the PCB board. It is conceivable that they cannot be operated in batches, affecting quality and efficiency. Generally, the chip will not have loose materials, but more likely to be other components, such as power LED lamp, FPC seat and so on. The supplier's delivery is wrapped in a package bag. This is only suitable for small workshops, small batch production, or R & D and testing, rather than products suitable for normal mass production.
The above is the related content of "IC chip taping" brought by the core creation test. I believe you have a preliminary understanding of the packaging selection of components. If you like this article, you might as well continue to pay attention to our website, and we will bring more wonderful content later. If you have any needs related to the inspection and testing of electronic products, please call Chuangxin testing, and we will serve you wholeheartedly.