What is the purpose of IC chip baking? What are the conditions and requirements?

Date：2021-11-11 11:39:44Views：4465

Integrated circuits are divided into commercial devices, industrial devices, automotive industrial devices and military devices. The operating temperature range is also different. Commercial grade devices are 0 ~ + 70 ℃, industrial grade devices are - 40 ~ + 85 ℃, automotive industrial grade devices are - 40 ~ + 125 ℃, and military grade devices are - 55 ~ + 155 ℃. Whether the device can be baked can be judged according to the temperature level and baking temperature of the device.

What is the purpose of IC chip baking? The baking of chip IC chip uses the principle that water can gradually evaporate under the heating state to dehumidify the damp chip by heating the chip. The baking of the chip can quickly remove the moisture inside the chip, so as to ensure the chip drying before going online, so as to avoid the adverse effects of chip moisture on subsequent processes.

The sensitivity levels of IC components are divided into eight levels: Level 1, level 2, level 2a, level 3, level 4, level 5, level 5A and level 6. The unpacking service life of level 1 and level 2 is more than one year, while level 6 can be used only after baking, so it is not involved in this benchmark;

The general requirements for baking conditions of IC components with sensitivity level of 2a-5a are shown in table A. for details, please refer to the printed materials on the surface of the packaging bag

Comparison table of general requirements for baking conditions of IC components

BGA module exceeds the control period, the vacuum packaging state fails, the humidity indicator card after vacuum packaging is unpacked exceeds the regulations, and there is no vacuum packaging in bulk. If it is baked for many times, the total baking hours must be less than 96 hours, and the main chip (BGA) of all customers within the control range shall be 120 ℃± 5 ℃ × Bake for 6 hours, and other customers bake according to customer requirements or device thickness standards.

Humidity indicator card discrimination

Humidity indicator card (HIC) requirements

1. In dry sealed MBB packaging, if HIC 5% RH color indicator turns pink and 10% does not turn blue, MSD of grade 2a-5a needs to be baked and re sealed;

2. In dry sealed MBB packaging, if HIC 60% RH color indication point is not blue, all MSDS (Level 2 and above) shall be baked and re sealed;

3. According to the actual incoming materials of the company, if the incoming instruction card is HIC containing 5%, 10% and 15% color indication points, it indicates that the manufacturer uses the standard of jstd033a and can be used under concession, but it needs to ask the manufacturer to promise to follow the improvement plan required by jstd033b.

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