Principle, advantages and reference standards of X-ray technology detection chip

Date：2021-11-09 13:54:46Views：1680

X-ray testing technology is a mature nondestructive testing method. At present, it is widely used in the fields of material testing (IQC), failure analysis (FA), quality control (QC), quality assurance and reliability (QA / REL), R & D (R & D), etc. It can be used to detect the delamination, crack and other defects (crack, delamination, cavity, etc.) of electronic components, LEDs and metal substrates, judge whether there are defects in the material by detecting the image contrast, determine the shape and size of defects, and determine the orientation of defects.

Everything has its working principle. Many people may not know the principle of ultra-high definition imaging X-ray detection equipment. In fact, it is made of X-ray tube, high-voltage generator and control electronic equipment to control exposure, timing and excess power. A modern high-quality X-ray tube can perform perspective imaging or continuous X-ray generation, so as to visually manipulate the internal anatomical structure of X-ray images in real time. A series of accurate and complex validity verification processes will be carried out before the chip is produced and listed. X-ray is mainly used to detect whether each solder joint on the semiconductor chip is effective. As the chip volume is designed to be smaller and smaller, X-ray detection equipment needs to have high magnification and resolution, and the requirements for detection accuracy are very high, so as not to miss important solder joint defects.

Meaning of X-ray detection:

X-ray detector uses low-energy X-ray to quickly detect the internal structure of the tested object without damaging the tested object.

High voltage impact target is used to produce X-ray penetration to detect the internal structure quality of electronic components, semiconductor packaging products, and the welding quality of various types of SMT solder joints

Advantages of X-ray detection:

As a mainstream detection in the current market, X-ray detection mainly uses the X-ray generated by the X-ray machine to irradiate the chip surface. Due to the strong penetration of X-ray, it can image after penetrating the chip, so that the internal defects of the chip can be seen at a glance. In addition, X-ray has no damage to the chip detection, so it is also called nondestructive testing. In addition to the detection of chips, the defect detection of lithium batteries, led beads, semiconductors and other products can be carried out perfectly through it.

X-ray detection reference standard:

Reference standards: ipc-a-610e acceptance standard for electronic assemblies, GB / T 17359-1998 general rules for quantitative analysis methods of electron microprobe and scanning electron microscope X-ray energy spectrum

X-ray test items:

1. Inspection of integrated circuit packaging process: layer stripping, cracking, cavity and wiring process;

2. Printed circuit board manufacturing process inspection: welding wire offset, bridging, open circuit;

3. Weldability test of surface mount process: detection and measurement of solder joint cavity;

4. Inspection of connecting lines: open circuit, short circuit, abnormal or poor connection defects;

5. Integrity inspection of solder balls in solder ball array packaging and chip cladding packaging;

6. High density plastic material cracking or metal material inspection;

7. Chip size measurement, line arc measurement, component tin area ratio measurement.

In conclusion, X-ray testing technology has become a necessary means to verify product quality. With the iterative update of new semiconductor chip technology, X-ray detection technology is also developing towards high precision and intelligence, closely following the new trend and requirements of semiconductor packaging and testing. At present, we are still stepping up technological upgrading to meet the detection needs of semiconductor chips.