Failure analysis and detection of electronic product materials

Date：2021-10-22 16:12:00Views：903

With the rapid development of science and technology and industrial production, people have higher and higher requirements for the quality of mechanical parts. Although the quality of materials and the precision of parts have been greatly improved, the early failure of mechanical parts used in various industries still occurs from time to time. Through failure analysis, it is essential to find out the failure causes and put forward effective improvement measures to prevent the recurrence of similar failure accidents, so as to ensure the safe operation of the project. Failure analysis is an independent discipline. It was first applied in military industry. With the continuous improvement of this discipline, its application scope is also expanding.

Failure analysis involves many disciplines, such as metallography, materials science, corrosion science, reliability analysis, fracture analysis, engineering mechanics, nondestructive testing, microanalysis, etc.

Product failure analysis company common failure modes

Fracture: ductile fracture, brittle fracture, fatigue fracture, stress corrosion fracture, fatigue fracture, creep fracture, liquid metal embrittlement, hydrogen embrittlement

Corrosion: chemical corrosion, electrochemical corrosion

Wear: abrasive wear, adhesive wear, fatigue wear, fretting wear and deformation wear

Others: functional failure, physical performance degradation, etc

The causes of failure can be roughly divided into several categories:

First, material structure defects, such as structural defects of as cast metal (shrinkage cavity, porosity, segregation, bubble, white spot, etc.), internal or external defects of forged and rolled metal parts (coarse widmanstatte, network carbide and banded structure, decarburization, folding, scratch, scar, crack, delamination, etc. of steel surface layer), inclusions, welding structural defects Structural defects caused by heat treatment;

The second is environmental factors, which generally refers to the corrosion of parts caused by the environment, such as chemical corrosion, electrochemical corrosion, high-temperature oxidation, etc.

Third, design defects, unreasonable stress of parts in actual use, etc.

Failure analysis is a complex subject. In order to obtain satisfactory results, it is necessary to completely preserve the accident site, service data and failed parts.

Failure analysis object

1. Various materials and parts (metal, plastic, ceramic, glass, etc.)

2. Electronic components (resistance, capacitance, resistance network, inductance, relay, electrical connector, contactor, etc.)

3. Semiconductor discrete devices (diode, triode, FET, thyristor, crystal oscillator, optocoupler, diode stack, IGBT, etc.)

4. Electromechanical devices (relays, mechanical switches, MEMS)

5. Cables and connectors (aviation connectors, various types of cables)

6. Microprocessor (51 series single chip microcomputer, DSP, SOC, etc.)

7. Programmable logic devices (Gal, pal, ECL, FPGA,, CPLD, EPLD, etc.)

8. Memory (EPROM, SRAM, DRAM, MRAM, DDR, flash, nor flash, NAND flash, FIFO, etc.)

9. AD / DA (DAC7611, max525, ADC0832, ad9750, etc.)

10. General digital circuit (CMOS 4000 series, 54 series, 80 Series)

11. Simulator (operational amplifier, voltage comparator, follower series, voltage controlled oscillator, sample holder, etc.)

12. Microwave devices (frequency multiplier, mixer, receiver, transceiver, up converter, voltage controlled oscillator, amplifier, power divider, coupler, etc.)

13. Power supply (linear voltage regulator, switching power converter, power monitor

14. Power management, led, PWM controller, DC / DC, etc.)

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