Purpose of chip baking: under what circumstances does BGA chip need to be baked?

Date：2021-10-21 17:26:00Views：2934

Under what circumstances does BGA chip need to be baked? IC, BGA and other devices are called humidity sensitive devices. Their storage and baking are based on the requirements of IPC standards. Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected, fabricated on a small or several small semiconductor chips or dielectric substrates, and then encapsulated in a tube shell to become a micro structure with the required circuit functions. This structural feature determines that integrated circuit chips will be composed of different materials. The joint of these materials will produce more or less gaps. These gaps may not be visible to the naked eye, but when the integrated circuit chip is placed in the environment, the water in the environment will penetrate into the chip through infiltration. And cause the chip to be damp.

When IC, BGA and other IC chips are affected with moisture, the moisture inside the chip will vaporize due to the sharp rise of temperature during thermal processes such as reflow soldering. Cause a sharp increase in volume and cause the expansion and deformation of the chip. In serious cases, popcorn will be directly formed and the chip will be directly scrapped. If it is slightly inferior, it will cause the current situation such as the lack of chip function. If it is slight, it will produce defects such as cracking, delamination, peeling, microcrack and so on. These defects will lead to hidden dangers such as short service life and poor effect of the chip. Seriously affect the corporate reputation.

Different humidity sensitivity levels have different baking conditions. Generally, 125 degree baking is adopted. If you are worried about oxidation and aging, or the material belt is easy to deform at high temperature. It can be baked at 90 degrees + 5% RH or 40 degrees + 5% RH. It is not recommended to use a nitrogen filled oven. The nitrogen cost of the nitrogen filled oven is too high. If you do not bake, sudden heating is easy to cause blistering and delamination damage inside the chip. The purpose of baking is to prevent this reason.

Steps and set temperature of chip baking:

1. Firstly, turn on the oven power supply and preheat the oven. The technical parameter of preheating temperature is set to 80 ℃ (80 ℃ in general and 100 ℃ in special cases)

2. When the oven temperature is preheated to 80 ℃, tear off the plastic bag packaging the chip Put the chip IC chip and BGA chip to be baked into the oven. After the oven is full, close the oven door, bake and start timing.

3. Set the oven temperature of 80 ℃± 10 ℃ and the baking time of 2H-4H according to the standard requirements

4. During baking, personnel must patrol to check the operation of the oven, especially the temperature, exhaust equipment and indicator light

5. After baking to the specified time, open the oven, check whether the chip IC chip and BGA chip are dried, and take the chip out of the oven after confirming that it is OK

6. After baking, turn off the power switch of the oven!

Precautions for chip baking:

1. The oven must be preheated to the specified temperature before loading the chip for baking

2. Under normal circumstances, it must be baked to the specified time before it can be out of the oven

3. Do not damage the chip during baking!

4. Do not put cardboard, paper and other inflammables in the oven! Baking time and baking temperature must be controlled and recorded!

In conclusion, the baking time of the chip should not exceed the time required by the standard. The baking time within the standard can dehumidify the chip well. And conditional factories can also try to use lower temperature baking conditions for chip baking. In this way, the chip can be dried without additional influence. Ready to use is the best way to prevent the chip from getting wet. Our testing services include: electronic component testing and verification, IC true and false identification, product design and material selection, failure analysis, function testing, factory incoming material inspection, tape braiding and other testing items. Warmly welcome to call, we will serve you wholeheartedly.