Introduction to main equipment for semiconductor appearance inspection and performance test

Date：2021-09-29 14:20:00Views：1681

Semiconductor equipment is electrical equipment manufactured using semiconductor components. Semiconductor refers to the material whose conductivity is between conductor and insulator at room temperature. Semiconductors are widely used in radio, television and temperature measurement. For example, diodes are devices made of semiconductors. A semiconductor is a material whose conductivity can be controlled from insulator to conductor. From the perspective of science and technology or economic development, the importance of semiconductors is very great. Today, the core units of most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is one of the most influential semiconductor materials in commercial applications. Semiconductor testing is mainly to detect the appearance and performance of the chip, in order to ensure the product quality. Let's take a look at the main semiconductor packaging test equipment:

Thinning machine

Due to the requirements of manufacturing process, high requirements are put forward for the dimensional accuracy, geometric accuracy, surface cleanliness and surface microcrystalline lattice structure of the wafer. Therefore, in hundreds of process flows, only a certain thickness of wafer can be used to transfer and flow in the process. Usually, a certain thickness of excess substrate material on the back of the wafer needs to be removed before integrated circuit packaging. This process is called wafer back thinning process, and the corresponding equipment is wafer thinning machine. The thinning machine thins the wafer substrate by thinning / grinding to improve the chip heat dissipation effect. Thinning to a certain thickness is conducive to the later packaging process.

Dicing machine

Dicing machine includes grinding wheel dicing machine and laser dicing machine. Among them, the grinding wheel dicing machine is a precision numerical control equipment that integrates the technologies of hydro pneumatic electric, aerostatic high-speed spindle, precision mechanical transmission, sensor and automatic control. It is mainly used for cutting materials such as silicon integrated circuits, light-emitting diodes, lithium niobate, piezoelectric ceramics, gallium arsenide, sapphire, alumina, iron oxide, quartz, glass, ceramics and solar cells. Grinding wheel dicing machine is also called precision grinding wheel cutting machine in China.

Laser scribing machine uses high-energy laser beam to irradiate the workpiece surface to make the irradiated area melt and gasify locally, so as to achieve the purpose of scribing. Because the laser becomes a very small light spot after being focused by a special optical system, the energy density is high. Because its processing is non-contact, there is no mechanical impulse pressure on the workpiece itself, and the workpiece is not easy to deform. It is widely used in cutting and dicing of solar panels and thin metal sheets.

test machine

The testing machine is a special equipment to test the function and performance of the chip. During the test, the tester applies the input signal to the chip to be tested, and the output signal is compared with the expected value to judge the electrical performance of the chip and the effectiveness of the product function. In the CP and FT detection links, the test opportunity transmits the results to the probe table and the sorter respectively. When the probe table receives the test results, it will conduct inkjet operation to mark the defective chip on the wafer; When the sorter receives the results from the tester, it will choose and classify the chips.

Sorter

Sorting equipment is applied to the FT test link after chip packaging. It is a post channel test equipment that provides chip screening and classification functions. The sorter is responsible for transporting the input chip to the test module according to the taking and placing mode designed by the system to complete the circuit voltage test. In this step, the sorter selects and classifies the circuit according to the test results. According to the system structure, the sorter can be divided into three categories, namely gravity sorter, turret sorter, translational pickup and pick place sorter.

Probe machine

The probe table is used for CP testing after wafer processing and before packaging process. It is responsible for the transportation and positioning of wafers, so that the grains on the wafers are in contact with the probes in turn and tested one by one. The work flow of the probe stage is: move the wafer under the wafer camera through the carrier stage - take the wafer image through the wafer camera to determine the wafer position - move the probe camera under the probe card to determine the probe head position - move the wafer under the probe card - realize needle alignment through the vertical movement of the carrier stage.

The above is the related content of "chip performance test" brought by the core creation test. Through this article, I hope it can be helpful to you. If you like this article, you might as well continue to pay attention to our website, and we will bring more wonderful content later. If you have any needs related to the inspection and testing of electronic products, please call Chuangxin testing, and we will serve you wholeheartedly.