Login | Join Free

Hotline

4008-655-800

Chip appearance inspection: application of visual inspection system in semiconductor industry

Date:2021-09-27 13:27:51Views:1501

Chips are often part of computers or other electronic devices. With the development of Industrial Science and technology in recent years, machine vision detection system is widely used in various fields, from medical images to remote sensing images, from industrial production detection to file processing, from nano technology to multimedia database, almost all occasions requiring human vision need machine vision detection system, especially in some fields that require high requirements or cannot be perceived by human vision, For example, accurate quantitative perception, dangerous scene perception, invisible object perception and so on, the role of machine vision detection system is particularly important.

As a big chip consumer, with the expansion of market demand and the upgrading of industrial scale, China has emerged a number of brands with strong international competitiveness. Machine vision has been widely used in the semiconductor industry, and its application range is becoming wider and wider, involving the detection and measurement of semiconductor appearance defects, size, quantity, flatness, spacing, positioning, calibration, solder joint quality, curvature and so on. How can we detect the appearance of the chip continuously, efficiently and quickly?

芯片外观检测:半导体行业中视觉检测系统的应用

1. Testing of small electronic components and industrial products

(1) Character detection of electronic components

Appearance inspection of small electronic components and small-size industrial products, appearance inspection of SMD products and application of silicon wafer appearance inspection. The detected contents include printing error, content error, image error, direction error, missing printing and surface defects. After high-speed and automatic photographing of the surface of the tested object, the data is transmitted to the computer for processing to find out the defective products.

(2) Assembly process inspection

Detection scope: component position, size, outer edge of object, character reading and verification, foot, appearance, etc.

2、 Flatness detection of IC chip and electronic linker

Check the number of pins and the geometric dimensions of multiple positions of pins, including pitch interval, width, height, curvature, etc.

3、 PCB board inspection

PCB component position, solder joint, circuit, opening size and angle; Computer micro communication interface, SIM card slot; Detection and measurement of the number of cable connectors, etc.

The above is the related content of "chip appearance inspection" brought by the core creation inspection. Through this article, I hope it can be helpful to you. If you like this article, you might as well continue to pay attention to our website, and we will bring more wonderful content later. If you have any needs related to the inspection and testing of electronic products, please call Chuangxin testing, and we will serve you wholeheartedly.

Baidu
map