Electronic product testing: read and understand chip reliability testing

Date：2021-09-26 16:44:36Views：3157

Reliability test refers to measuring and verifying the reliability of products through tests. The research finds out the weak links of products under the condition of limited samples, time and use cost. Reliability test is the general name of various tests carried out to understand, evaluate, analyze and improve the reliability of products. The test to measure, verify or improve product reliability is called reliability test. It is an important link of product reliability.

Accelerated test

The lifetime of most semiconductor devices can exceed many years under normal use. But we can't wait a few years to study devices; We must increase the applied stress. The applied stress can enhance or accelerate the potential failure mechanism, help identify the root cause, and help ti take measures to prevent failure modes.

In semiconductor devices, some common acceleration factors are temperature, humidity, voltage and current. In most cases, accelerated testing does not change the physical characteristics of the fault, but will change the observation time. The change between acceleration conditions and normal use conditions is called "derating".

High acceleration testing is a key part of JEDEC based qualification testing. The following tests reflect the high acceleration conditions based on JEDEC specification jep47. If the product passes these tests, it means that the device can be used in most use cases.

Temperature cycle

According to jed22-a104 standard, the temperature cycle (TC) allows the component to undergo the conversion between extreme high temperature and low temperature. During this test, the component is repeatedly exposed to these conditions for a predetermined number of cycles.

High temperature service life (HTOL)

HTOL is used to determine device reliability under high temperature operating conditions. The test is usually conducted for a long time according to jesd22-a108 standard.

Temperature humidity bias high accelerated stress test (bhast)

According to jesd22-a110 standard, THB and bhast make the device withstand high temperature and high humidity conditions and under bias voltage. Their goal is to accelerate the corrosion of the device. THB and bhast are used for the same purpose, but bhast conditions and test process make the reliability team test much faster than THB.

Hot press / unbiased hast

The autoclave and unbiased hast are used to determine the device reliability under high temperature and high humidity conditions. Like THB and bhast, it is used to accelerate corrosion. However, unlike these tests, no bias is applied to the component.

High temperature storage

HTS (also known as "baking" or htsl) is used to determine the long-term reliability of devices at high temperatures. Unlike HTOL, the device is not in operating conditions during the test.

Electrostatic discharge (ESD)

Static charge is the non-equilibrium charge when standing. Usually, it is caused by the friction or separation of insulator surfaces; One surface gains electrons and the other loses electrons. The result is an unbalanced electrical condition called electrostatic charge.

When electrostatic charge moves from one surface to another, it becomes electrostatic discharge (ESD) and moves between the two surfaces in the form of micro lightning.

When the static charge moves, a current is formed, so the gate oxide layer, metal layer and junction can be damaged or damaged.

JEDEC tests ESD in two ways:

1. Human discharge model (HBM)

A component level stress used to simulate the behavior of the human body releasing the accumulated static charge to the ground through devices.

2. Charged device model (CDM)

A component level stress that simulates charging and discharging events in production equipment and processes according to JEDEC jesd22-c101 specification.

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