Solderability testing method for surface assembled components

Date：2021-09-23 11:42:19Views：1449

The surface mounting device is a single unit, the surface plane surface former surface or surface surface equipment, SMC or SMD, and it is very small or small, and it is a fine surface permanent device. The following are the main products of the subsurface. The surface of the SMT is processed by the surface of the original equipment. It is possible to moisturize and moisturize.

The method of the original vessel was made in the same way as the SMT body of the SMT. The SMT processor is 90% waste. It is under the same condition.

1, reflux: 235 ℃ 5 ° C., 10 to 15 s (265 to 270 ℃, 10 to 15 s).

2, wave ridge: 260 ℃ ± 5 ° C., 5 s ± 0.5 s (270 to 272 ° C., 10 s ± 0.5 s).

More than 40 times more than 40 times larger than the above, there are more than 40 times of the appearance, the original sealing, the leg of the legs, the disappearance of the legs, the color, the fragility, etc. of the elephant It is a characteristic that the performance of the product is carried out, and the number of the numbers of the numbers of the number of the producers is fixed, and the request is decided.

Caution: the ability to take advantage of the durability of the product is acceptable.

The process of processing is to be examined.

(1)

2.

(3) Sot, SOIC, QFP non legged inverted form, distance distance multi shift SMD leg orthotropic. IMMM.

(4) request cleanliness goods, the uncleanliness of the Yuan Dynasty, and the performance and availability of the original.

The following are the main features of this report: the surface system of the surface system, the content of the contents, the main text, and the hope of the above. Please note that the contents of the contents will be more detailed. We will be able to take care of what you have to offer.