In nondestructive testing technology, X-ray detection chip is fast, accurate and efficient

Date：2021-09-08 11:28:00Views：1306

Now, with the continuous improvement of people's requirements for the quality and reliability of electronic products, the requirements for the quality of chips are becoming higher and higher. Chip failure is inevitable in the process of development, production and use. Therefore, chip detection and analysis is becoming more and more important. As the appearance of forged electronic components becomes more and more realistic, it can not be distinguished by the naked eye. It is also at this time that X-ray test equipment appeared. Compared with traditional destructive physical analysis and fault analysis, X-ray has the advantages of timeliness, cost and professionalism. They have obvious advantages.

At present, the mainstream nondestructive testing methods on the market mainly include AOI, ultrasonic and X-ray testing. AOI is to inspect the appearance of the product, but not the interior of the product; Although ultrasonic testing belongs to nondestructive testing, its disadvantage is that it can not save the test results better, and it has high requirements for operators; X-ray nondestructive testing has perfectly overcome the disadvantages of the previous two testing methods. It can not only detect the internal defects of products, but also save the product analysis in the form of images. This testing method plays a very key role in later data analysis and comparison, and the equipment operation is simple and the results are accurate.

Due to the increasingly strict inspection of electronic product quality by relevant national functional departments, X-ray nondestructive testing equipment, which is effective for chip testing, has also been more widely used.Industry insiders engaged in X-ray nondestructive testing in related industries pointed out that X-ray testing equipment has a series of advantages such as nondestructive, easy to use and high testing accuracy. Through the detection equipment, the internal state of electronic components can be well detected, and even the angle, current, voltage and image of electronic equipment can be detected. The X-ray tube can pass through. In order to obtain the corresponding effective image information based on contrast and brightness, it can be well compared with conventional original products, so that the authenticity of components can be easily recognized.

Now, with the rise of various intelligent terminal devices, people's requirements for the quality and reliability of electronic products are constantly improving, and the requirements for the quality of chips are also higher and higher. In the process of development, production and use, chip failure is inevitable. Therefore, chip inspection and analysis become more and more important. Electronics manufacturers have adopted mature technology for chip testing. Through analysis, it can help designers find defects in chip design, mismatch of process parameters or improper design and operation. This requires the use of chip testing equipment X-ray equipment, so there is no need to worry about the internal defect detection of the chip.