What do you know about BGA packaging chip welding quality inspection?

Date：2021-09-06 15:48:39Views：1875

With the progress of electronic technology, electronic products begin to develop to light, thin and small, and their functions are more advanced. After several generations of upgrading, BGA (grid array) has become a high-density chip packaging technology entering the practical stage. How to ensure BGA package welding quality? How to detect BGA quality? How to determine the location of BGA defects? It is the key to ensure the quality of bgasmt.

After welding, BGA components may have different problems and defects due to assembly equipment, environment and welding technology. Common BGA defects include misalignment, loose welding, open circuit, cold welding, bridging, short circuit, cavity, etc. In addition, BGA solder balls may be missing or falling off, and the size is uneven. Since the solder ball is lower than the chip, it is difficult to judge the welding quality after welding, which affects the detection of BGA. Traditional visual inspection can not determine whether there are defects or cavities in the welded joint. X-ray real-time imaging inspection equipment must be used to clearly judge the quality of the welded joint.

After BGA components are used in smtga components, the inspection methods usually rely on include electrical test, boundary scan and X-ray inspection.

Traditional electrical tests can scan open and short circuit defects. Boundary scan technology relies on the inspection port of boundary scan design, which can access each solder joint on the boundary connector to check the open circuit and short circuit on the component.

Although boundary scan can detect a wider range of invisible solder joints than electrical detection, these two methods can only detect electrical properties, not welding quality. In order to ensure and improve the quality of production process, we must rely on X-ray testing equipment for welding quality testing, especially those invisible solder joints. X-ray detection can effectively solve problems, real-time imaging, software automatic analysis and judgment, data storage and recording, so as to ensure quality control and real-time data feedback in the production process.