What detection equipment will be used in IC chip? Importance of Xray detection

Date：2021-08-26 14:09:00Views：1657

Speaking of the ubiquitous IC chips around us, many people are not unfamiliar with it. For example, the chips in mobile phones, televisions and computers we use every day are actually IC chips, which are translated into Chinese as integrated circuits. The structure of IC chip is to place the integrated circuit formed by a large number of microelectronic components such as capacitance and resistance on the substrate, so as to make the chip. The current situation and development trend of chip test equipment industry chip production needs hundreds of steps, and any step of error may lead to device failure. Therefore, chip detection is very important. Using good chip testing equipment and methods is one of the keys to improve the level of chip manufacturing.

How to make IC chip? IC chip is mainly composed of numerous micro electronic devices and components, so it is very accurate. Through the corresponding manufacturing process, the transistors, resistors, capacitors, diodes and other components and wiring required in the circuit are connected together to make a small or even several small semiconductor chips or dielectric substrates, and then encapsulated in a tube shell to become a microstructure with the required circuit function. The special equipment required mainly includes lithography machine, chemical vapor deposition (CVD) equipment, etching machine, ion implantation machine, surface treatment equipment, etc. required for wafer manufacturing; Cutting and thinning equipment, measuring defect detection equipment, bonding packaging equipment, etc. required for packaging; Testing machine, sorting machine, probe table, etc. required for testing link; And diffusion, oxidation and cleaning equipment required by other front-end processes. The manufacturing of these equipment requires the comprehensive use of science and technology such as optics, physics and chemistry, which has the characteristics of high technical content, difficult manufacturing and high equipment value.

It is worth noting that in the whole production process, all components form a whole in structure, which has taken a big step towards miniaturization, low power consumption and high reliability. Of course, the more accurate the circuit, the greater the difficulty of detection. At present, when testing chips in China, we often peel the chips layer by layer, and then photograph each layer of the surface of the chip with an electron microscope. This traditional detection will bring some damage to the chip. X-ray testing is a non-destructive testing method to find defects by using the characteristics of X-ray penetration and attenuation in materials. The wavelength of X-ray is very short, generally 0.001 ~ 0.1nm. X-rays propagate in a straight line at the speed of light, are not affected by electric and magnetic fields, can penetrate substances, attenuate in the process of penetration, and can make the film sensitive.

As a mainstream detection in the current market, X-ray detection mainly uses the X-ray generated by the X-ray machine to irradiate the chip surface. Due to the strong penetration of X-ray, it can be imaged after penetrating the chip, so that the internal defects of the chip can be seen at a glance. When X-rays penetrate matter, due to the interaction between rays and matter, a series of extremely complex physical processes will occur. As a result, the rays will be absorbed and scattered and lose some energy, and the intensity will be weakened accordingly. This phenomenon is called ray attenuation. The essence of X-ray flaw detection is to obtain the latent image generated by the defect projection on the photosensitive material (film) according to the different attenuation degree of the ray energy of the inspected workpiece and its internal defect medium, and obtain the defect image after dark room processing, and then evaluate the nature and negative film level of the internal defects of the workpiece according to the standard.

In a word, X-ray does not damage the chip detection, so it is also called nondestructive testing. In addition to detecting chips, the defect detection of lithium batteries, led beads, semiconductors and other products can evaluate the quality of materials or products according to the nature, size and position of defects, so as to prevent major accidents caused by internal defects and poor processing of materials.