How to identify counterfeit components by Xray detection

Date：2021-08-13 18:22:00Views：1350

Electronic parts are electronic parts and parts of small motors and instruments. They are usually composed of several parts and can be used in similar products. With the continuous progress of modern technology, the appearance of forged electronic components becomes more and more realistic, which can not be distinguished by the naked eye. At this time, X-ray test equipment appeared. Compared with the traditional destructive physical analysis and fault analysis, the advantages of X-ray lie in timeliness, cost and professionalism.

With the rise of various intelligent terminal devices, people have higher and higher requirements for the quality and reliability of electronic products, and higher and higher requirements for the quality of chips. In the process of development, production and use, chip failure is inevitable. Therefore, chip inspection and analysis become more and more important. Electronics manufacturers have adopted mature technology for chip testing. Through analysis, it can help designers find defects in chip design, mismatch of process parameters or improper design and operation. This requires the use of chip test equipment X-ray equipment.

Purpose and method of chip testing

The main purpose of chip testing is to find out the factors affecting product quality in the production process as soon as possible, and prevent batch production from exceeding tolerance, maintenance and scrapping. This is an important method of product process quality control. With internal perspective function, it is used for nondestructive testing. It is usually used to detect various defects in chip packaging, such as layer delamination, fracture, gap and wire bonding integrity. In addition, X-ray NDT can also check the possible defects in the PCB manufacturing process, such as poor alignment or bridge open circuit, short circuit or abnormal connection, and detect the integrity of solder balls in the package. It can not only detect invisible solder joints, but also qualitatively and quantitatively analyze the inspection results to find problems as soon as possible.

Principle of X-ray chip inspection

In the process of chip inspection, the X-ray inspection equipment launched by domestic professional X-ray inspection equipment manufacturers can improve the efficiency of chip inspection. The X-ray inspection equipment uses an X-ray emission tube to generate x-rays, which pass through the chip sample and generate a projection on the image receiver. Its high-definition imaging can be magnified 1000 times by the system, which can more clearly display the internal structure of the chip.

In fact, in the face of those chips that look very realistic but have defective internal structure on the market, it is obvious that they cannot be distinguished with the naked eye. Therefore, X-ray testing equipment provides sufficient guarantee for product chip testing in the production process of electronic products, and plays an important role.

Advantages of X-ray chip nondestructive testing

Practice has proved that X-ray has obvious advantages in the timeliness and cost of chip testing. The advantage of X-ray nondestructive testing is that it can not only detect the internal defects of products, but also save the analysis projection of products in the form of images. This test method plays a key role in future analysis and comparison.

With the increasingly strict requirements of the relevant functional departments of the state for the quality inspection of electronic products, the effective X-ray nondestructive testing equipment for chip inspection has been more and more widely used. In this way, it can be compared with conventional original products, so that the real value of components can be easily checked, and the true and false components can be identified.