What are the reliability test items for component products? List of electronic industry standards attached

Date：2021-07-21 13:23:00Views：1361

Nowadays, there are many kinds of products that need reliability testing. Through reliability testing, we can determine the reliability characteristics of electronic products when they work or store under various environmental conditions, so as to provide useful data for use, production and design; It can also expose the problems existing in the design, raw materials and process flow of the product. Since enterprises have different testing requirements according to different needs, what reliability testing items need to be tested in most cases of electronic components? Let's take a look.

What is reliability testing?

The test to evaluate and analyze the reliability of electronic products is called reliability test. For different products, in order to achieve different purposes, different reliability test methods can be selected.

Reliability test: also known as reliability evaluation of products, it refers to the ability of products to complete specified functions under specified conditions and within specified time. In the process of design and application, the product is constantly affected by its own and external climate environment and mechanical environment, but still needs to work normally. Therefore, it needs to be verified with test equipment. This verification is basically divided into three parts: R & D test, trial production test and mass production sampling inspection. Reliability test includes aging test, temperature and humidity test, gas corrosion test, mechanical vibration test, mechanical impact test, collision test and drop test, dust and waterproof test, packaging pressure test and other environmental reliability tests.

Environmental test is to assess the adaptability of products under various environmental conditions (vibration, impact, centrifugation, temperature, thermal shock, hot tide, salt spray, low air pressure, etc.), and it is one of the important test methods to evaluate the reliability of products. Generally, there are the following types:

1. Stability baking, i.e. high temperature storage test

Test purpose: to assess the impact of high temperature storage on products without applying electrical stress. Products with serious defects are in non-equilibrium state, which is an unstable state. The transition process from non-equilibrium state to equilibrium state is not only the process of inducing the failure of products with serious defects, but also the process of promoting the transition of products from unstable state to stable state.

2. Temperature cycling test

Test purpose: to assess the product's ability to withstand a certain temperature change rate and extreme high temperature and extreme low temperature environment It is set for the thermomechanical properties of the product. When the thermal matching of the materials constituting each part of the product is poor or the internal stress of the part is large, the temperature cycle test can lead to the failure of the product caused by the deterioration of mechanical structure defects. Such as air leakage, internal lead fracture, chip crack, etc.

3. Thermal shock test

Test purpose: to assess the product's ability to withstand severe temperature change, that is, large temperature change rate. The test can lead to the failure of the product caused by the deterioration of mechanical structure defects The purpose of thermal shock test is basically the same as that of temperature cycle test, but the conditions of thermal shock test are much more severe than that of temperature cycle test.

The heat capacity is an important factor to ensure the test conditions.

4. Low pressure test

Test purpose: to assess the adaptability of the product to low pressure working environment (such as high-altitude working environment). When the air pressure decreases, the insulation strength of air or insulating materials will weaken; It is easy to produce corona discharge, increase dielectric loss and ionization; The decrease of air pressure will worsen the heat dissipation conditions and increase the temperature of components. These factors will cause the sample to lose the specified function under low air pressure, and sometimes cause permanent damage.

5. Moisture resistance test

Test purpose: To evaluate the decay resistance of microcircuit under humid and hot conditions by applying accelerated stress, which is designed for typical tropical climate environment. The main decay mechanism of microcircuit under wet and hot conditions is the physical process of corrosion caused by chemical process and the increase of microcrack caused by water vapor immersion, condensation and icing. The test also examines the possibility of occurrence or intensification of electrolysis of microcircuit materials under wet and hot conditions. Electrolysis will change the resistance of insulating materials and weaken the ability to resist dielectric breakdown.

6. Salt spray test

Test purpose: To evaluate the corrosion resistance of exposed parts of components and parts under salt fog, humid and hot conditions by accelerated method, which is designed for tropical seaside or marine climate environment The exposed parts of components with poor surface structure will be corroded under salt fog, Hunan humidity and hot conditions.

The general reliability items and types are also described in detail in the article on this website. You can click the link to view: //www.pouchinit.com/162.html 。