What are the common hot and cold shock testing items for IGBT chips?

IGBT (Insulated Gate Bipolar Transistor)chipThe thermal shock test is mainly used to evaluate its reliability and performance under extreme temperature changes. Here are some common cold and hot shock testing items:

1. Temperature cycling test

· objective: SimulationThe temperature changes experienced by IGBT in actual working environment.

· process: WillIGBT chips quickly switch between high and low temperatures, typically cycling between -40 ° C and+150 ° C, and observing their performance changes.

2. Thermal shock test

· objective: EvaluationThe tolerance of IGBT under rapid temperature changes.

· process: WillIGBT chips quickly transition from high temperature environments to low temperature environments, or vice versa, observe whether cracks or failures occur.

3. Damp heat test

· objective: EvaluationThe performance and reliability of IGBT in high humidity environments.

· processTesting is usually conducted in high temperature and high humidity environmentsObserve for corrosion or insulation failure at 85 ° C and 85% relative humidity.

4. Functional testing

· objective: EnsureIGBT functions normally after thermal shock.

· processAfter the thermal shock test, conduct electrical performance tests, including parameters such as on resistance, switching speed, and leakage current.

5. Reliability testing of solder joints

· objectiveEvaluate the reliability of welded connections under thermal shock.

· processTest the solder joints through cold and hot cycling to check for cracks or detachment.

6. Mechanical stress testing

· objective: EvaluationMechanical stability of IGBT under thermal shock.

· processApply mechanical stress in combination with temperature changes and observeIs the physical structure of IGBT affected.

7. X-ray examination

· objectiveDetect changes in internal structure after thermal shock.

· process: UseX-ray equipment checks whether the internal connections and packaging of IGBT chips are intact.

8. Failure analysis

· objectiveAnalyze failure modes after testing.

· process: For those that have failedConduct a detailed analysis of IGBT to determine the cause of failure and improve design and manufacturing processes.

summary

Through the above thermal shock testing items, manufacturers can comprehensively evaluateThe performance and reliability of IGBT chips under extreme environmental conditions ensure their stability and safety in practical applications.