Common chip failure analysis methods and processes

Chip Failure AnalysisIt refers to the integration of circuits（IC）Conduct systematic investigation and analysis of faults that occur during use to determine the cause of the fault and provide improvement suggestions. The commonly used failure analysis methods and processes are as follows:

 Common Failure Analysis Methods

1. Optical microscope examination:

   - Use an optical microscope to observe the surface of the chip and inspect visible physical defects such as scratches, cracks, solder joint issues, etc.

2. Scanning electron microscope（SEM）：

   - adoptSEMObtain high-resolution images to observe smaller defects and material structures.

3. Spectral analysis（EDS）：

   - combinationSEMPerform energy spectrum analysis to determine material composition, identify changes in chemical composition or pollutants.

4. XRadiographic imaging:

   - useXX-ray technology is used to inspect the internal structure of chips, especially the connection between solder joints and the packaging.

5. Failure Mode and Effects Analysis（FMEA）：

   - Systematically evaluate potential failure modes and their impact on the system to help identify high-risk areas.

6. Thermal imaging analysis:

   - By using thermal imaging technology to detect the thermal distribution of the chip during operation, identify issues of overheating or thermal failure.

7. Electrical testing:

   - Confirm the electrical performance of the chip under different conditions and identify the electrical characteristics of failure through functional testing and parameter testing.

8. Fault simulation:

   - By simulating fault conditions and reproducing the failure situation, it can help determine the cause of the failure.

Failure analysis process

1. Fault collection:

   - Collect relevant information about failed chips, including fault symptoms, usage environment, working conditions, etc.

2. Preliminary assessment:

   - Conduct a preliminary assessment of the fault, determine the nature and scope of the failure, and select appropriate analysis methods.

3. Sample preparation:

   - Prepare appropriate samples for failed chips, including cutting, polishing, cleaning, etc., for subsequent analysis.

4. Detailed analysis:

   - Use the above failure analysis methods for detailed inspection and testing, collect data and images.

5. Data analysis:

   - Analyze the collected data to identify failure modes and root causes.

6. Report writing:

   - Write a failure analysis report, detailing the analysis process, identified defects, root causes, and improvement suggestions.

7. Improvement measures:

   - Based on the analysis results, propose improvement measures, optimize design, process or materials to prevent similar failures from happening again.

8. Verification and Confirmation:

   - After implementing improvement measures, conduct verification testing to confirm the effectiveness of the improvements.

 summary

Chip failure analysis is a systematic and multi-step process that involves multiple technical means. Through effective failure analysis, potential problems can be identified and resolved, improving the reliability and performance of chips, and reducing the risk of subsequent failures.