What are the purposes, conditions, and requirements for baking IC chips?

IC chipBaking is an important process step mainly used to remove moisture and other volatile substances from chips to ensure their performance and reliability. The following are the purposes, conditions, and requirements for baking IC chips:

objective

1. Remove moisture:

-Moisture may affect the electrical performance of chips, and even cause short circuits or other malfunctions.

2. Preventing welding defects:

-During the soldering process, if there is moisture inside the chip, it may lead to the formation of bubbles, affecting the soldering quality.

3. Improve reliability:

-By removing volatile substances, the reliability of chips can be improved in high temperature or high humidity environments.

4. Extend storage life:

-Baking can reduce the risk of chips getting damp during storage and transportation, and extend their service life.

Conditions and requirements

1. Baking temperature:

-Usually between 70 ° C and 125 ° C, adjusted according to the type of chip and manufacturer's recommendations.

2. Baking time:

-Generally between 2 hours and 24 hours, depending on the packaging type and moisture content of the chip.

3. Environmental humidity:

-The baking environment should maintain low humidity to avoid further moisture absorption.

4. Baking equipment:

-Use professional baking equipment to ensure even temperature distribution and avoid hot and cold spots.

5. Cooling process:

-After baking, it should be slowly cooled to avoid chip damage caused by sudden temperature changes.

6. Monitoring and recording:

-Record the temperature and time during the baking process for traceability and quality control.

7. Anti static measures:

-During the baking and processing process, anti-static measures should be taken to prevent static electricity from damaging the chip.

Summary

Baking IC chips is an important step in ensuring chip performance and reliability. By controlling temperature, time, and environmental conditions, moisture can be effectively removed, welding defects can be prevented, and the overall quality and reliability of the chip can be improved.