Deep Analysis of False Welding between PCB Board and Parts

In the field of electronic manufacturing, the soldering quality of printed circuit boards (PCBs) and their components directly affects the performance and lifespan of products. Among them, "false welding" is a common welding defect phenomenon, and its impact on electronic products cannot be ignored. This article will provide an in-depth analysis of the appearance characteristics, hazards, and causes of false soldering between PCB boards and parts.

Firstly, let's understand the appearance characteristics of false soldering between PCB boards and parts. False soldering refers to the failure of the solder between electronic components and PCB pads to form a good metallurgical bond during the soldering process, resulting in the solder joint surface appearing intact but not effectively connected.

Dirty surface: Abnormal stains or oxidation can be seen on the welding surface, usually caused by poor welding process or unclean environment.

Virtual welding phenomenon: There is incomplete bonding at the welding site, which may be caused by factors such as insufficient welding temperature, insufficient welding time, or poor welding material quality.

Solder balls and solder nodules: Abnormal protrusions or spherical objects appear at the welding site, which may be caused by excessive solder or inappropriate welding pressure, affecting the quality of circuit connections.

Lack of welding or missing welding: Insufficient coverage or gaps in the welding area may be caused by high welding temperature, long welding time, or inappropriate welding pressure, which may lead to circuit interruption or short circuit.

Secondly, the hazards brought by false welding are multifaceted:

Unstable circuit connection: phenomena such as virtual soldering and missing soldering can directly affect the stability of the circuit connection, which may lead to equipment failure and affect the reliability and service life of the product.

Signal transmission distortion: Welding problems can lead to a decrease in signal transmission quality, which may result in decreased equipment performance or functional failure.

Increased production costs: The need for additional repair and rework work will increase production and time costs, while also affecting product delivery time and customer satisfaction.

Finally, we need to delve into the causes of false welding. The main reasons for false soldering between PCB and parts are as follows:

Improper process parameters: Improper welding temperature and time may lead to welding quality issues, and it is necessary to ensure that welding is carried out under appropriate process parameters.

Poor material quality: Quality issues such as solder and PCB board materials can directly affect the welding quality, so it is necessary to choose appropriate welding materials and PCB board materials.

Improper operation: Insufficient technical level of operators or incomplete operating procedures may lead to false welding problems, and training and standardized operating procedures are needed to ensure product quality.

In general, identifying and preventing the problem of false soldering between PCB boards and parts is crucial. This requires optimizing the welding process, strictly controlling the production environment, selecting appropriate materials, and improving employee operating skills from multiple perspectives to ensure the high quality and reliability of electronic products.