DPA destructive physical analysis of electronic components

Destructive Physical Analysis (DPA) of electronic devices is a technique that can help manufacturers determine the safety performance of components under potential attacks. It is a very important part of the electronics industry, helping to achieve high-quality and safe product production. After the secondary screening of components is qualified, destructive physical analysis (DPA Destructive Physical Analysis) tests should be conducted on components with unstable quality and significant improvement in production processes in the early stage. The focus is on conducting this work on semiconductor discrete devices and semiconductor integrated circuits with cavities. Its purpose is to verify whether the quality of the components meets the relevant specifications or intended use.

What is destructive physical analysis (DPA) of electronic components? Destructive Physical Analysis (DPA) of components is a testing technique that can measure the safety performance of components under potential attacks. It can identify the weaknesses and defects of components, as well as potential vulnerabilities that may arise under attack. This can help manufacturers better understand the security performance of their products and take necessary measures to eliminate vulnerabilities. The process of destructive physical analysis (DPA) of electronic components is usually divided into the following steps:

Step 1: Collect information

Before conducting destructive physical analysis (DPA) of components, it is necessary to collect information about the components. This information may include the model of the component, manufacturer, safety regulations, supplier, etc. In addition, it is necessary to collect any safety documents or specifications related to the components.

Step 2: Component disassembly

Before conducting destructive physical analysis (DPA) on components, they need to be disassembled. This usually requires the use of tools such as micro tools and microscopes. When disassembling components, it is necessary to record any issues or defects found.

Step 3: Physical analysis

During the destructive physical analysis (DPA) of components, various physical analyses are required. This may include:Electron microscopy analysis,X-ray analysis,Thermal analysis,Chemical analysis,Magnetic analysis.

These analyses can help identify the physical characteristics, defects, weaknesses, etc. of components.

Step 4: Attack simulation

During destructive physical analysis (DPA) of components, attack simulation is required. This can help identify potential vulnerabilities and weaknesses in components under potential attacks.

Attack simulation may include the following content:Intrusion of components,Chemical attack,Heat attack,Electromagnetic attack,Mechanical attack.

Step 5: Analyze the results

After completing the destructive physical analysis (DPA) of the components, the results need to be analyzed. This may include identifying any discovered defects, weaknesses, or vulnerabilities, as well as providing recommendations on how to address these issues. The destructive physical analysis (DPA) of DPA application components is widely used in various industries, especially in the military and aviation fields. It can help determine the security performance of the device, as well as potential vulnerabilities and weaknesses that may arise under potential attacks.

In addition, it can also help manufacturers identify how to improve the safety performance of their products.Shenzhen Chuangxin Online Testing Laboratory was established in 2006. As a professional third-party IC testing institution in China, it offers eight service projects including IC authenticity testing, DPA testing, failure analysis, development and functional verification, material analysis, reliability verification, electromagnetic compatibility (EMC), and chemical analysis. We provide one-stop solutions for enterprises worldwide.