Principle and process flow of reflow soldering

Reflow soldering is a welding process mainly used for connecting surface mount components in electronic manufacturing. If you are interested in the upcoming content, please continue reading the following text, hoping it will be helpful to you.

The principle and process flow are as follows:

Principle:

Reflow soldering melts and solidifies the metal powder in the solder paste through the process of heating and cooling, thereby permanently connecting the components to the PCB (printed circuit board).

Process flow:

1. PCB surface treatment:

Firstly, clean the surface of the PCB to remove grease and dirt to ensure a good soldering effect.

Apply solder paste to the areas that need to be welded in preparation for welding.

2. Automatic arrangement of components:

Use automated equipment, such as SMT mounting machines, to accurately place components in predetermined positions on the PCB.

3. Heating process:

Preheating zone: Gradually heat the PCB board to help the solvent in the solder paste evaporate, reduce the generation of bubbles, and slow down the temperature difference between the PCB board and components, reducing thermal shock.

Constant temperature zone: Keep the temperature stable, ensure that all components reach the same temperature, and prepare for welding.

Reflow soldering zone: The solder paste melts at a specific temperature, forming mechanical and electrical connections. This stage requires precise control of temperature and time to ensure welding quality.

Cooling zone: Gradually cool the PCB board from a high temperature state, allowing the welding material to solidify and form a stable connection. Control the cooling speed to avoid thermal stress caused by excessive cooling.

4. Inspection:

Inspect the appearance and electrical performance of the welded circuit board to ensure that the welding quality meets the requirements.

Conduct visual inspection, testing, and repair on PCB boards that have already been welded to ensure product quality and reliability.

Through this process, reflow soldering can efficiently and accurately complete the soldering work of electronic components, ensuring the high quality and reliability of electronic products.

The above is the content on the principles and process flow of reflow soldering compiled by the Chuangxin Testing editor, hoping to be helpful to you. Our company has a team of professional engineers and industry elites, with three standardized laboratories covering an area of over 1800 square meters. We can undertake various testing projects such as electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, functional testing, factory incoming material inspection, and ribbon weaving.