Deep Analysis and Application Progress of Semiconductor Internal Visual Inspection Technology

Date：2024-04-02 14:58:49Views：13

With the rapid development of semiconductor technology, ensuring the quality and reliability of chip products has become one of the key elements of industry development. Semiconductor internal visual inspection technology, as an important means of verifying chip quality, covers various advanced detection methods to discover and analyze subtle defects, abnormal connections, and other issues that may cause product failure in the internal structure of chips. The following are the main aspects of semiconductor internal visual inspection technology:

1. Automated Optical Inspection (AOI):

AOI is mainly used for semiconductor components and PCB boards in surface mount technology (SMT) production lines. Through high-resolution cameras and complex image processing algorithms, it can quickly detect external features such as solder joint quality, pin arrangement, and packaging integrity. However, for the detection of the internal structure of semiconductors, AOI is limited by its optical penetration ability.

2. Scanning Electron Microscopy (SEM):

SEM can observe the surface and shallow internal structure of semiconductor devices at a nanoscale resolution. It scans the sample by emitting an electron beam and constructs a three-dimensional image based on the signals generated by the interaction between electrons and the sample, thereby detecting small cracks, pollution, particulate matter, and defects in the metal interconnect layer.

3. Transmission Electron Microscopy (TEM):

TEM is more in-depth in detecting the internal microstructure of semiconductors. It can penetrate the sample and reveal defects at the nanometer or even atomic level, such as crystal defects, impurity distribution, film thickness, and interface conditions. This is crucial for understanding device performance.

4. X-ray Computed Tomography (XCT) and X-ray Fluoroscopy (X-RAY Inspection):

X-ray testing technology is an important means of visual inspection inside semiconductors. X-RAY detection uses X-rays to penetrate semiconductor chips without damaging their internal structure. The detector captures the attenuation image after X-ray penetration, which then displays the internal lamination, filler distribution, welding quality, and the presence of defects such as voids and cracks. XCT can provide three-dimensional internal structural information.

5. Acoustic Microscopy or Ultrasonic Inspection:

This non-destructive testing technique propagates high-frequency ultrasound through the sample and determines the integrity of the internal structure based on changes in reflected echoes. It is suitable for detecting internal defects in packaged chips, such as cracks, voids, bubbles, and adhesive quality.

6. Electroluminescence detection (EL):

For optoelectronic devices such as power semiconductors and LEDs, electroluminescence detection can reflect the internal defects of the devices under powered operation, such as small current leakage paths, local overheating areas, and uneven band structures.

In summary, modern semiconductor internal visual inspection technology has developed into a comprehensive detection system that integrates various physical methods such as optics, electronics, X-ray, and acoustics. This not only improves the sensitivity and accuracy of defect detection, but also greatly supports quality control and process improvement in the semiconductor industry. With the continuous innovation of technology, these visual inspection technologies will continue to drive the semiconductor industry towards higher yield and better performance in the future.