Test conditions and evaluation standards for high and low temperature tests
Date:2024-03-28 16:37:12Views:43
The high and low temperature box has a wide temperature control range, and its performance indicators meet the technical conditions of the national standard GB/T10592 high and low temperature test box. It is suitable for conducting low temperature and high temperature tests on products in accordance with GB/T2423.1 and GB/T2423.1 and GB/T2423.2 Environmental Testing for Electrical and Electronic Products - Test A: Low Temperature Test Method, Test B: High Temperature Test Method. Suitable for high and low temperatures of electrical and electronic products (including components, equipment, and other products).
High and low temperature testing is a method used to determine the adaptability of products to storage, transportation, and use in high-temperature climate conditions. The severity of the experiment depends on the high temperature and exposure duration.
High and low temperature testing standards:
Detailed Introduction to High Temperature Test: This test is used to determine the adaptability of products to storage, transportation, and use under high temperature climate conditions. The severity of the experiment depends on the high temperature and exposure duration.
Reference test standards: GB/T 2423.2, IEC 60068-2-2, IEIA 364, MIL-STD-810F, etc.
Introduction to Low Temperature Test: This test is used to determine the adaptability of products to storage, transportation, and use under low temperature climate conditions. The severity of the experiment depends on the low temperature and exposure duration.
Reference test standards: GB/T 2423.1, IEC 60068-2-1, EIA 364, MIL-STD-810F, etc.
Alternating humidity and heat test: The high and low temperature alternating humidity and heat test is an essential testing project in the fields of aviation, automotive, home appliances, scientific research, etc. It is used to test and determine the parameters and performance of electrical, electronic, and other products and materials after undergoing high temperature, low temperature, alternating humidity and heat, or constant temperature environmental changes.
Test reference standards: GB/T 2423.1, GB/T 2423.2, GB/T 2423.3, GB/T 2423.4.
Introduction to temperature shock test: This test is to determine the adaptability of products to storage, transportation, and use in climate environments with rapid temperature changes. The severity of the experiment depends on high/low temperature, residence time, and number of cycles.
Reference test standards: IEC60068-2-14, GB2423.22, GJB150.5, etc.
Introduction to Rapid Temperature Change Test: This test is used to determine the adaptability of products to storage, transportation, and use in rapidly or slowly changing climate environments with high or low temperatures. The experimental process takes room temperature → low temperature → low temperature residence → high temperature → high temperature residence → room temperature as a cycle, and the severity of the temperature cycling test is determined by the high/low temperature range, residence time, and number of cycles.
High and low temperature test conditions:
1、 High temperature test:
Non charged storage: 70 ℃, maintained for 48 hours, restored for 2 hours, test whether the equipment is working properly; Live working: 55 ℃, maintain working condition, observe whether the equipment is working properly; According to standards: GJB 150.3A-2009, GBT2423.2, etc.
2、 Low temperature test:
Non charged storage: -40 ℃, maintained for 24 hours, restored for 2 hours. Test whether the equipment is working properly; Live working: -20 ℃, maintain working condition, observe whether the equipment is working properly; Reference standards: GJB 150.4A-2009, GBT2423.1, etc.
3、 Damp heat test:
This test should be conducted in accordance with GB/T2423.4 Test Db. Except for performance testing, the tested device shall not be powered on.
Temperature:+55 ℃ and+25 ℃; Number of cycles: 2 (respiratory effect); Time: 2 x 24 hours
High and low temperature test methods:
First, adjust the temperature of the box to 25 ℃± 3 ℃ and maintain this value. Adjust the relative humidity to 45%~75% for 2 to 6 hours of stable temperature treatment. Within the last hour, increase the relative humidity inside the box to no less than 95%, while maintaining a temperature of 25 ℃± 3 ℃.
After the stable stage, the cycle begins, allowing the box temperature to continuously rise from 25C ± 3 ℃ to 55 ℃± 2 ℃ within 2.5h to 3h. During this period, except for the last 15 minutes when the relative humidity is not less than 90%, the relative humidity during the heating stage should not be less than 95% to produce condensation on the surface of the test sample, but excessive condensation should not occur on large test samples.
Then maintain in a high temperature and humidity environment of 55 ℃± 2 ℃ until 12 hours ± 0.5 hours from the start of the cycle. The relative humidity during this stage should be (93 ± 3)%, except for the initial and final 15 minutes when it is not less than 90%.
Then, within 3 to 6 hours, reduce the box temperature from 55 ℃± 2 ℃ to 25 ℃± 3 ℃. The initial cooling rate for 1.5 hours is 10 ℃/h, during which the relative humidity is not less than 90% except for the first 15 minutes, and is not less than 95% at all other times.
After cooling down, the temperature should be maintained at 25 ℃± 3 ℃, and the relative humidity should not be lower than 95%. Starting from the beginning of the cycle, it should be counted as one cycle for 24 hours.
The above is the content related to high and low temperature tests organized by the editor of Chuangxin Testing, hoping to be helpful to you. Our company has a team of professional engineers and industry elites, with three standardized laboratories covering an area of over 1800 square meters. We can undertake various testing projects such as electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, functional testing, factory incoming material inspection, and ribbon weaving.