Internal visual inspection standards for semiconductor chip packaging before packaging

Date：2024-03-27 17:28:09Views：56

1、 Overview of Internal Visual Inspection of Chips

Visual inspection of the interior of the chip before packaging is a necessary step to ensure the quality and reliability of the chip after packaging. Visual inspection can effectively detect defects, foreign objects, defects, etc. inside the chip, thus avoiding the introduction of more problems during the packaging process. Therefore, internal visual inspection of chips is a necessary task before chip packaging.

2、 Internal visual inspection standards for chips

The commonly used internal visual inspection standards for chips now mainly include the following aspects:

1. Defect detection

Defect detection mainly detects whether there are defects inside the chip, such as cracks, scratches, and other issues in the middle part.

2. Mark detection

Mark detection refers to the detection of whether the device model, batch number, etc. marked on the surface of the chip are clear and accurate, as well as whether the chip appearance and external interfaces meet the requirements.

3. Dust and pollution detection

Dust and pollution detection mainly focuses on whether there are dust, pollution and other issues on the surface of the chip. If these problems exist, they will directly affect the reliability and service life of the chip.

4. Welding points and corrosion detection

Solder joint and corrosion detection is mainly aimed at detecting chip solder joints and metal connectors, including welding quality, whether the front solder pads are neat, etc.

5. Chip appearance inspection

Chip appearance inspection mainly checks whether the surface of the chip is flat, smooth, and whether there are scratches, scratches, and other issues.

3、 Internal visual inspection process of chips

The internal visual inspection process of chips needs to be set according to specific varieties and models, but the general process is roughly the same:

1. Preparation work: including cleaning the surface of the chip, conducting safety checks, etc.

2. Preparation of visual inspection equipment: Visual inspection equipment generally includes microscopes, micro cameras, detection programs, and related software.

3. Visual inspection operation process: Conduct internal visual inspection of the chip, and pay attention to recording the visual inspection operation process for reference.

4. Visual inspection result processing: Handle the visual inspection results, and promptly report and handle any problems found.

In summary, the internal visual inspection standards before semiconductor chip packaging are an indispensable part of the semiconductor manufacturing process, which can ensure the quality and reliability of semiconductor chips and provide a solid guarantee for the development of semiconductor technology. With the continuous development of semiconductor technology, it is believed that the internal visual inspection standards for semiconductor chip packaging will also be continuously improved and improved.