What tests should be done for the quality of electronic components? X-ray detection is not unknown

Date：2021-04-28 17:26:00Views：1599

At present, China's electronic processing industry is developing rapidly. At the same time, the market has higher and higher requirements for the quality of electronic products. Especially in circuit assembly, higher specifications are put forward for detection methods and technologies. The detection of components is an essential basic work. Different methods must be adopted according to different components to judge whether the components are normal or not. So what tests should be done to test the quality of electronic components? Let's have a look!

There are three main types of testing items for electronic components:

1.Routine test

Mainly test the appearance, size, electrical performance and safety performance of electronic components;

Basic parameters such as triode shall be tested according to the specifications of components, including appearance, size, Icbo, Vceo, Vces, HFE, pin tension, pin bending, weldability, welding heat resistance and other items. RoHS shall also be tested for some export products.

2.Reliability test

It mainly tests the service life and environmental test of electronic components;

According to the requirements of the user and the specification, test the service life of the device and various environmental tests, such as triode, and carry out high-temperature test, low-temperature test, moisture test, vibration test, maximum load test, high-temperature durability test and other tests;

3.DPA analysis

It mainly controls the internal structure and process of the device.

Such as triode, the main means include X-ray detection of internal structure, acoustic scanning monitoring of internal structure and packaging process, unsealing monitoring of internal wafer structure and size, etc. Among them, X-ray real-time imaging technology is increasingly widely used. It is favored by more and more electronic product manufacturers because of its non-destructive, fast, easy-to-use and relatively low cost. X-ray detection can be used to check the internal status of components, such as chip layout, lead layout, lead frame design, solder ball (lead), etc. For components with complex structure, the angle, voltage and current of the X-ray tube, as well as the contrast and brightness of the image can be adjusted to obtain effective image information.

Working principle of X-ray detection equipment:

The X-ray detection equipment penetrates the sample to be tested through X-ray, and then emits an X-ray image in the image detector. The formation quality of the image is mainly determined by resolution and contrast. The resolution of the imaging system depends on the X-ray. The X-ray released by high-pressure accelerated electron impact on the metal plate penetrates the sample and leaves an image. Technicians observe the relevant details of the sample through the brightness of the image.

Importance of X-ray testing electronic components:

It has the function of penetrating imaging and can clearly detect the internal defects of electronic components. In addition to the capacitor X-ray inspection, the X-ray can also perform the following inspections: component layer peeling, cracking, voids and cable integrity inspection. In the production of electronic components, PCB may have defects such as poor alignment or bridging and open circuit. SMT solder joint cavity inspection, for example, detecting open circuit, short circuit or abnormal connection defects in various connecting wires; Check the integrity of solder balls in solder ball array packaging and chip packaging; Cracks in high-density plastic materials or metal materials are detected; Chip size measurement, arc measurement, element tin area measurement, etc; These are the uses of X-rays.