IC is hard to distinguish between true and false, charming eyes! X-ray detection makes fake components invisible

Date：2021-04-27 15:53:00Views：1475

X-ray uses the cathode ray tube to produce high-energy electrons to collide with the metal target. In the process of impact, due to the sudden deceleration of electrons, the lost kinetic energy will be released in the form of X-ray. It is convenient to analyze the internal cracks and foreign matter defect detection of metal materials and parts, plastic materials and parts, electronic components, electronic components and LED components, as well as the internal displacement analysis of BGA and circuit board; Identify BGA welding defects such as empty welding and false welding, microelectronic system and adhesive sealing components, cables, fittings, internal conditions of plastic parts, etc. Counterfeit products appear in almost every industry. The problem of component counterfeiting is common, and has penetrated into the whole electronic component supply chain. Equipment manufacturers need to establish a strong defense system.

How are counterfeit chips produced? There are hundreds of chips on a wafer. After the wafer is produced, it should be tested and marked with bad marks; The tested wafers are cut and packaged. After packaging, we see the chip with pins. The chip marked as bad in the packaging stage will also be discarded. The chips that fail to pass the test are recycled by the manufacturer who bought the bare chips, cut and bound by himself, but the chips marked as bad will also be discarded.

The harm of counterfeit chips? Do not underestimate the importance of electronic components in your projects and business operations. Even small parts can cause or damage equipment. If some items fail or are not implemented as expected, it will lead to problems related to safety and product performance. The problem with fake parts is mainly because they are of poor quality, so they are more likely to fail than real parts.

Some counterfeit electronic components are easy to identify. Typical examples include wrong component number, suspicious company logo, lack of some number sequence, scratches on the outer package, wrong component classification or product name, etc. Other details are difficult to detect, so deconstructive testing must be carried out. The practice of this kind of counterfeit components is usually to obtain components from dismantling and discarding IC. These components are welded to the original joints with new welding wires and repackaged in military grade packaging. This counterfeit chip must be X-ray inspected, further disassembled and electronically tested in order to confirm its authenticity.

Why are IC components counterfeiting repeatedly prohibited? Profiteering is the most important reason for criminals to take risks. Most of the fake components are "foreign garbage" recycled by ton from abroad (many components can not be made in China, but are imported from abroad). After a series of processes such as sorting, disassembly, tape weaving, vacuum pumping, marking and renovation, they become the same as the new ones. This kind of disassembled parts is much cheaper than new ones. Usually, the formal testing process is time-consuming and costly, so some wafer factories will sell untested wafers to manufacturers who need bare chips, and the latter will test them themselves. However, the latter usually does not have good test equipment. At the same time, in order to save money and reduce test items, some chips that could not pass in the semiconductor factory are used in the final products, resulting in the instability of product quality.

Problems caused by fake components may affect their circuits and other nearby components, making the damage more expensive and difficult to repair. There is no hiding place for components to pass X-ray detection. X-ray detection brings new development opportunities with new technological changes. It has the penetration detection ability of "super hard core". X-ray penetration is generated by striking the target with high voltage, which can quickly and accurately detect the quality of the tested product without damaging the tested product.