Principles and standard specifications for cold and hot shock of electronic products

Date：2024-01-18 13:50:55Views：84

Cold and hot shock testing, also known as temperature shock, heat shock testing, etc., simulates the testing of samples in environments with drastic temperature changes or alternating high and low temperatures. Electronic products often encounter temperature changes during use, such as rapid transitions between high and low temperatures and temperature changes. These temperature changes may have an impact on the performance and reliability of electronic products, so it is necessary to conduct cold and hot shock tests on electronic products. This article will introduce the principles and standard specifications of cold and hot shock in electronic products.

1、 The principle of cold and hot shock

Cold and hot shock testing is a testing method that simulates the usage environment of electronic products under temperature changes. In testing, electronic products are placed in high and low temperature environments, or quickly converted between high and low temperatures to simulate temperature changes in actual use. Through testing, the performance and reliability of electronic products at different temperatures can be understood, providing reference for product design and manufacturing.

The principle of thermal shock testing is to use the physical principles of thermal expansion and contraction. When electronic products are exposed to high temperatures, the material will expand, while in low temperatures, the material will shrink. This change in thermal expansion and contraction may lead to structural deformation, material fatigue, welding looseness, and other issues in electronic products. Through cold and hot shock testing, the performance and reliability of electronic products under temperature changes can be tested, thereby improving product quality and reliability.

2、 Standard specifications

In order to ensure the accuracy and comparability of cold and hot shock testing, a series of standard specifications have been developed internationally. The following are common standard specifications for cold and hot shock testing:

1. MIL-STD-810

MIL-STD-810 is a testing standard developed by the US Department of Defense to test the performance and reliability of military equipment in various environments. This standard includes multiple testing methods, including temperature change testing methods such as thermal shock testing and cold shock testing.

2. IEC 60068

IEC 60068 is a testing standard developed by the International Electrotechnical Commission to test the performance and reliability of electronic products under different environmental conditions. This standard includes multiple testing methods, including temperature change testing methods such as thermal shock testing and cold shock testing.

3. JESD22-A104

JESD22-A104 is a testing standard developed by the Electronic Industry Association of America to test the performance and reliability of electronic products under temperature changes. This standard includes methods and requirements for cold and hot shock testing, such as testing temperature range, testing time, testing frequency, etc.

4. GB/T 2423.22

GB/T 2423.22 is a testing standard developed by the National Standardization Administration of China, used to test the performance and reliability of electronic products under temperature changes. This standard includes methods and requirements for cold and hot shock testing, such as testing temperature range, testing time, testing frequency, etc.

The above standards and specifications all include methods and requirements for cold and hot impact testing, which can serve as reference standards for cold and hot impact testing of electronic products.

3、 Purpose

1. Product development stage: Timely identify and correct design defects in PCB boards, allowing design defects to end in the development stage, shortening the development cycle and reducing costs.

2. Product production stage: Check whether the quality of the product meets customer requirements, identify production process defects in a timely manner, identify and improve the causes, and ensure the safety and quality of the shipped products.

3. Material and process certification: Evaluate whether the substrate, ink, PP, process, etc. used meet the reliability of the product.

4. Material and process research: Compare the cold and hot shock resistance of products with different substrates, inks, and processes, and select the best materials and processes.

Cold and hot shock testing is an important testing method for electronic products, which can detect the performance and reliability of electronic products under temperature changes. In testing, it is necessary to follow standard specifications to ensure the accuracy and comparability of the test. Through cold and hot shock testing, the quality and reliability of electronic products can be improved, providing reference for product design and manufacturing.