How does BGA check welding quality? Introduction to Common Methods

Date：2023-10-18 16:54:23Views：563

The quality of solder joints is crucial for determining the reliability and performance of SMT components, and the quality of BGA solder joints should be crucial. Therefore, it is crucial to take effective measures to ensure the quality of BGA components' solder joints and achieve the ultimate reliability of SMT components. This article will introduce common methods for BGA welding quality inspection.

1. X-ray testing

X-ray testing is a non-destructive testing method that can be used to detect the quality of BGA solder joints. In X-ray testing, X-rays are received by the detector through BGA components and PCB boards. By analyzing the X-ray images received by the detector, information such as the position, shape, size, and connection status of the solder joint can be detected. X-ray testing can detect welding defects that are difficult to detect through other methods, such as voids, solder joints, and missed welds inside the welding ball.

2. Infrared detection

Infrared detection is a non-contact detection method that can be used to detect the temperature distribution of BGA solder joints. In infrared detection, an infrared camera is used to take photos of solder joints. By analyzing the temperature distribution of the solder joints, the quality of the solder joints can be detected. For example, if the temperature distribution of the solder joint is uneven, there may be issues such as solder leakage or cold welding.

3. Visual inspection

Visual inspection is an intuitive detection method that can judge the quality of solder joints by observing their appearance with the naked eye. For example, the shape of the solder joint should be circular or elliptical, the surface of the solder joint should be smooth and flawless, and there should be sufficient clearance between the solder joint and the PCB board. Visual inspection can quickly detect the appearance defects of solder joints, such as false soldering, excessive solder, irregular shape of solder joints, etc.

4. Acoustic testing

Acoustic testing is a method of detecting the quality of solder joints through sound waves. In acoustic testing, sound waves can be generated by tapping or vibrating solder joints. By analyzing parameters such as frequency, amplitude, and time of sound waves, the quality of solder joints can be detected. For example, if the sound wave reflection of the solder joint is poor, there may be problems such as poor soldering or cold soldering.

In summary, checking the quality of BGA welding is very important and can be detected through various methods. Different methods have different advantages and disadvantages, and appropriate methods should be selected for testing based on specific circumstances. At the same time, in order to ensure the accuracy of the testing results, it is recommended to make necessary preparations before conducting the testing, such as cleaning the solder joints and calibrating the testing instruments.