Standard for DPA testing of electronic components

Date：2023-09-22 15:58:37Views：310

DPA (Destructive Physical Analysis) detection of electronic components is a method of determining the cause and mechanism of failure through physical analysis of electronic components. Unlike conducting DPA attacks on the entire encryption device, component DPA detection focuses on analyzing the power consumption changes of individual electronic components. The following is a detailed introduction to the DPA testing standards for electronic components.

1. MIL-STD-1580: This standard is issued by the US Department of Defense and is mainly applicable to DPA testing of military electronic components. This standard specifies the process, methods, and standards for DPA testing of components, including visual inspection, dimensional inspection, material analysis, metal structure analysis, and internal structure analysis of components.

2. MIL-STD-883: This standard is issued by the US Department of Defense and is mainly applicable to DPA testing of semiconductor devices. This standard specifies the process, methods, and standards for DPA testing of semiconductor devices, including visual inspection, dimensional inspection, material analysis, metal structure analysis, and internal structure analysis of components.

3. JEDEC JESD22-A104: This standard is published by the JEDEC Solid State Technology Association and is mainly applicable to DPA testing of semiconductor devices. This standard specifies the process, methods, and standards for DPA testing of semiconductor devices, including visual inspection, dimensional inspection, material analysis, metal structure analysis, and internal structure analysis of components.

4. IPC-9702: This standard is issued by IPC (Association Connecting Electronics Industries) and is mainly applicable to DPA testing of electronic components. This standard specifies the process, methods, and standards for DPA testing of electronic components, including visual inspection, dimensional inspection, material analysis, metal structure analysis, and internal structure analysis of components.

5. NASA-STD-8739.1: This standard is issued by the National Aeronautics and Space Administration (NASA) of the United States and is mainly applicable to DPA testing of aerospace electronic components. This standard specifies the process, methods, and standards for DPA testing of aerospace electronic components, including visual inspection, dimensional inspection, material analysis, metal structure analysis, and internal structure analysis of components.

The above is an introduction to DPA testing. If you have any needs in this regard, please feel free to consult Chuangxin Testing! Different standards are applicable to different types of electronic components, and the DPA testing process, methods, and standards may also vary. When conducting DPA testing on electronic components, applicable standards should be selected based on the specific situation, and testing should be carried out according to the processes, methods, and standards specified in the standards.