Standard for X-ray inspection of solder joints in electronic components

Date：2023-09-21 14:00:00Views：246

X-ray inspection of solder joints in electronic components is an important step in the production and maintenance process of electronic products, which can be used to detect the quality and reliability of solder joints. When conducting X-ray inspection of solder joints in electronic components, certain standards and specifications need to be followed to ensure the accuracy and reliability of the inspection results. To help everyone gain a deeper understanding, the following content is organized by Chuangxin Testing Network and provided for your reference.

Firstly, the X-ray inspection of electronic components requires adherence to the IPC-A-610 standard for solder joints. IPC-A-610 is an electronic component assembly standard that defines the standards and specifications for solder joints, including their shape, size, position, spacing, and connection quality. The IPC-A-610 standard also specifies acceptable and unacceptable defects and defect levels for solder joints, as well as the reliability and lifespan of solder joints.

Secondly, the X-ray inspection of electronic components requires the selection of appropriate X-ray equipment and detectors for solder joints. The selection of X-ray equipment and detectors requires consideration of factors such as the size, density, thickness, and material of electronic components. Usually, high-resolution X-ray equipment and detectors are required to ensure the detection of small solder joint defects and faults.

Thirdly, X-ray inspection of electronic components requires the use of appropriate sample holders and image processing software for solder joints. The sample holder can fix electronic components in the correct position to ensure that X-rays can penetrate the entire electronic component. Image processing software can process the generated images to improve their clarity and resolution.

Finally, electronic component X-ray inspection of solder joints requires professional analysis and explanation. The images generated by X-ray inspection need to be analyzed and interpreted by professional technicians to determine the quality and reliability of the solder joints. When analyzing and interpreting solder joint images, it is necessary to consider factors such as the shape, size, position, spacing, and connection quality of solder joints, as well as acceptable and unacceptable defects and defect levels defined in the IPC-A-610 standard.

The above is the X-ray inspection of solder joints organized by the core detection editor, hoping to be helpful to you. Chuangxin Testing is a professional testing institution for electronic components. Currently, it mainly provides integrated circuit testing services such as capacitors, resistors, connectors, MCU, CPLD, FPGA, DSP, etc. Specializing in functional testing of electronic components, appearance testing of incoming electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components, and ROHS composition analysis testing. Welcome to call, we will be happy to serve you!