Precautions for wire bonding tension testing

Date：2023-08-31 15:42:25Views：198

Wire bonding tensile test is one of the common wire bonding strength testing methods, which can be used to test the tensile strength and breaking force of wire bonding connections. In wire bonding tensile testing, a tensile tester is usually used for testing. This article summarizes some materials and hopes to provide valuable references for readers.

When conducting wire bonding tension testing, it is necessary to pay attention to the following aspects.

1. Selection of testing methods

There are two methods for wire bonding tension testing: static testing and dynamic testing. Static testing refers to testing solder joints under constant tension, while dynamic testing refers to testing solder joints under constantly changing tension. When selecting testing methods, it is necessary to choose appropriate methods based on specific application requirements.

2. Selection of testing parameters

When conducting wire bonding tensile testing, it is necessary to select appropriate testing parameters, including tensile strength, tensile speed, testing temperature, etc. These parameters directly affect the accuracy and reliability of test results, and need to be selected based on specific application requirements.

3. Sample preparation

Before conducting the wire bonding tensile test, it is necessary to prepare the sample, including cleaning, removing the oxide layer, cutting, etc. The sample preparation process needs to strictly follow standard operations to ensure the accuracy and reliability of the test results.

4. Control of the testing process

When conducting wire bonding tensile testing, it is necessary to strictly control the testing process, including the testing environment, testing equipment, testing personnel, etc. During the testing process, it is necessary to avoid external interference and ensure the accuracy and reliability of the test results.

5. Analysis of test results

After conducting the wire bonding tension test, it is necessary to analyze and evaluate the test results. The analysis of test results needs to consider multiple factors, including the shape of the solder joint, fracture mode, fracture location, etc. By analyzing and evaluating the test results, the quality and reliability of solder joints can be evaluated.

After reading this article, have you gained more understanding of the precautions for wire bonding tensile testing? That's all for today's content. If you find the content helpful, please follow Chuangxin Testing. We will provide you with more industry information!