What are the standards and items for testing electronic components?

Date：2023-07-12 15:15:02Views：269

Electronic components are components of electronic equipment and instruments, typically composed of multiple components that can be interchanged and used in similar products. They are usually some components in industries such as electrical appliances, radios, and instruments, such as capacitors, transistors, resistance wires, springs, etc. Among them, diodes are the most common type.

Electronic components include: resistance, capacitance, inductance, Potentiometer, electronic tube, radiator, electromechanical component, connector, semiconductor discrete device, electroacoustic device, laser device, electronic display device, photoelectric device, sensor, power supply, switch, micro and special motor, electronic transformer, relay, printed circuit board, integrated circuit, various circuits, piezoelectric, crystal, quartz, ceramic magnetic materials Substrates for printed circuits, specialized materials for electronic functional processes, electronic adhesive (tape) products, electronic chemical materials and components, etc. Today, we will introduce the standards and projects for detecting electronic components.

Test items:

1. Routine testing

Mainly testing the appearance, size, electrical performance, safety performance, etc. of electronic components

According to the specifications of the components, basic parameters such as transistors should be tested, including appearance, size, ICBO, VCEO, VCES, HFE, pin tension, pin bending, solderability, and welding heat resistance. Some exported products also need to be tested for RoHS.

2. Reliability testing

Mainly testing the lifespan and environmental testing of electronic components

According to the requirements of the user and the specifications, the lifespan of the device and various environmental tests should be tested, such as high temperature test, low temperature test, humidity test, vibration test, maximum load test, high temperature durability test, etc., for the transistor;

3. DPA analysis

Mainly aimed at controlling the internal structure and process of the device

For example, the main methods of a transistor include X-ray detection of the internal structure, acoustic scanning monitoring of the internal structure and packaging process, and unpacking monitoring of the internal wafer structure and size. The application of X-Ray real-time imaging technology is becoming increasingly widespread, and it is favored by more and more electronic product manufacturers due to its non-destructive, fast, easy-to-use, and relatively low-cost characteristics. X-ray detection can be used to check the internal status of components, such as chip layout, lead layout, lead frame design, solder balls (leads), etc. For components with complex structures, the angle, voltage, current, and image contrast and brightness of the X-ray tube can be adjusted to obtain effective image information.

Testing standards:

GB/T 18334-2001 Specification for Flexible Multilayer Printed Boards with Through Connections

GB/T 18335-2001 Specification for Rigid Flexible Multilayer Printed Boards with Through Connections

GB/T 3615-2007 Aluminum Foil for Electrolytic capacitor

GB/T 4166-1984 Test Methods for Variable Capacitors Used in Electronic Equipment

GB/T 4874-1985 General Specification for Fixed Metalized Paper Dielectric Capacitors for Direct Current Applications

GB/T 5993-2003 Fixed capacitors for use in electronic equipment - Part 4: Sectional specification - Solid and non solid electrolyte aluminum capacitors

GB/T 5994-2003 Fixed capacitors for use in electronic equipment - Part 4-1: Blank detail specification - Non solid electrolyte aluminum capacitors - Assessment level E

GB/T 28858-2012 Phenolic Packaging Materials for Electronic Components

GB/T 28859-2012 Epoxy Powder Packaging Materials for Electronic Components

The above is the standard and project related content for testing electronic components organized by Chuangxin Testing, hoping to be helpful to you. Our company has a team of professional engineers and industry elites, with three standardized laboratories covering an area of over 1800 square meters. We can undertake various testing projects such as electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, functional testing, factory incoming material inspection, and tape weaving.