Authoritative testing agency for packaging testing standards

Date：2023-06-29 15:05:08Views：296

Chip packaging testing is one of the important links in the chip manufacturing process. By testing the packaging of chips, it can ensure their reliability and stability, and meet relevant standards and requirements. This article will introduce the standards for chip packaging testing and the role of authoritative testing institutions, hoping to provide valuable references for readers.

The chip packaging testing standards mainly include the following aspects:

Packaging strength test: The chip packaging must be able to withstand certain physical damage such as pressure, impact, and vibration to ensure that the chip is not damaged during transportation and storage.

Moisture resistance test: Chips are susceptible to moisture during storage and transportation, so chip packaging must have good moisture resistance to ensure chip stability.

Anti theft buckle test: Anti theft buckles must be installed on the chip packaging to ensure that the chip is not opened or damaged without authorization.

Packaging sealing test: The chip packaging must be sealed to prevent contamination or damage during transportation and storage.

JEDEC Standard: JEDEC is the abbreviation of the Electronic Industry Federation of America, and is one of the most authoritative organizations in the global electronic industry. Its standards are widely used in the field of chip manufacturing and testing. The JEDEC standard includes multiple aspects such as chip packaging, packaging materials, testing methods, and reliability testing.

IPC Standard: IPC is an abbreviation for the International Electronics Industry Association and is one of the most representative organizations in the global electronics industry. The IPC standard mainly includes multiple aspects such as electronic manufacturing, assembly, and testing, including standards for chip packaging and testing.

MIL standard: MIL is the abbreviation of United States Military Standard, and its standards are widely used in military electronic equipment, aerospace and other fields. The MIL standard includes multiple aspects such as chip packaging, testing, and reliability testing.

Here are some suggestions for choosing authoritative testing institutions:

Qualifications and certifications: such as ISO 17025 certification, CNAS recognition, etc. These certifications can prove that the testing institution has a certain level of technical capability and quality assurance system.

Professionalism and experience: able to provide more comprehensive and accurate results for chip testing. You can learn about the history and customer evaluations of testing institutions to evaluate their professionalism and experience.

Equipment and technology: It can provide more efficient and accurate testing services, and can understand the equipment and technical level of testing institutions to evaluate their testing capabilities and reliability.

Service and Reporting: Able to provide customers with comprehensive testing and certification services. You can understand the service process and report format of testing institutions to evaluate the quality of their services and reports.

Authoritative testing institutions can provide professional chip packaging testing services to ensure the quality and safety of chip packaging. Chuangxin Testing is a professional testing institution for electronic components. Currently, it mainly provides integrated circuit testing services such as capacitors, resistors, connectors, MCU, CPLD, FPGA, DSP, etc. Specializing in functional testing of electronic components, appearance testing of incoming electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components, and ROHS composition analysis testing. Welcome to call, we will be happy to serve you!