How to conduct IC chip cover opening test? Focusing on the field of components

Date：2023-06-25 17:48:14Views：267

Component opening test refers to the opening of components for testing and analysis, and is also an important part of electronic product production. During the process of unpacking IC chips, it is necessary to follow some basic principles and methods to ensure the accuracy and reliability of testing. How to complete the unpacking of IC chips has become a common concern for electronic manufacturers.

IC chips, as the core components in modern electronic products, once problems occur, they will affect the performance and quality of the entire product. Therefore, in production, it is necessary to conduct open cover testing on IC chips to test their quality and reliability. The process of open cover testing is to peel off the packaging shell of the IC chip, expose the internal circuit of the chip, and detect whether there are defects, short circuits, open circuits, and other issues.

So, how to unpack IC chips? There are usually the following steps:

Equipment preparation: It is necessary to prepare powerful microscopes, precise microsurgical operation platforms, cover opening tools, and other equipment and tools.

Pre opening treatment: Soak the IC chip in deionized water for 10 minutes, then remove it and place it in a high-temperature oven for baking.

Cover opening operation: Based on the specific packaging form of the IC chip, use thermal knives or chemical solvents to peel off its shell, while ensuring that the chip's solder pads and connecting wires are not damaged.

Internal testing: Conduct electrical performance testing on the internal of the IC chip to detect defects, short circuits, open circuits, and other issues.

Repackaging: To repackage an IC chip, usually using methods such as epoxy packaging and metal cover packaging.

It should be noted that when conducting IC chip unpacking testing, certain operating standards and procedures need to be followed to avoid issues such as chip damage or information leakage caused by improper operation. At the same time, precise operations and inspections are required during the testing process to ensure the accuracy and reliability of the test results.

Overall, the opening of IC chips requires caution, care, and adherence to certain basic principles and methods. By correctly unpacking and testing, the quality and reliability of IC chips can be improved, reducing product failure rates and losses.

The above is the relevant content of component cover opening testing organized by Chuangxin Testing, hoping to be helpful to you. Chuangxin Testing is a professional testing institution for electronic components. Currently, it mainly provides integrated circuit testing services such as capacitors, resistors, connectors, MCU, CPLD, FPGA, DSP, etc. Specializing in functional testing of electronic components, appearance testing of incoming electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components, and ROHS composition analysis testing. Welcome to call, we will be happy to serve you!