Baking conditions and requirements for IC chips

Date：2023-06-12 16:13:53Views：965

IC chips are important products in the semiconductor industry, used in various electronic devices and systems, and their performance and reliability directly affect the performance and lifespan of electronic devices. In some special cases, it is necessary to meet the production requirements of chips through baking coordination. Below is an introduction to the conditions and requirements for baking IC chips.

1、 Baking temperature

The baking of IC chips refers to placing them in a high-temperature oven before packaging to remove air gaps and moisture in the chip and improve its reliability. Baking conditions usually include parameters such as temperature, time, and atmosphere. Excessive baking temperature can cause chip deformation, burnout, and affect electrical performance issues; If the baking temperature is too low, it can also affect the performance of the chip. Therefore, the most suitable temperature range for baking IC chips is generally between 100 ℃ and 150 ℃.

2、 Baking time

The baking time of IC chips is also very important. Long baking time can cause changes in the chip structure, leading to deformation and aging; If the baking time is too short, the purpose of baking cannot be completed. Generally speaking, the baking time of IC chips is usually within 6 hours.

3、 Baking environment

The baking temperature and time should be determined based on factors such as chip type, size, and process requirements. Generally speaking, the baking temperature should be higher than the chip tolerance temperature, and the time should be determined based on the chip size to ensure that the moisture and air gap inside the chip are completely removed. The baking environment requires cleanliness, dustproof, moisture-proof, and anti-static measures. Especially in high temperature and humidity environments, special protective measures are required. In addition, appropriate ventilation is required during the baking process.

4、 Baking method

The baking method of IC chips also needs to be selected based on specific circumstances. Generally speaking, common baking methods include hot air baking, infrared baking, microwave baking, vacuum baking, and other methods. Choosing an appropriate baking method requires considering various factors such as chip material, size, structure, and baking requirements.

The baking conditions and requirements for IC chips need to be comprehensively selected based on specific circumstances. Accurate baking conditions and good baking requirements can effectively improve the reliability and stability of chips, ensuring the stability and lifespan of electronic devices. During the baking process, special attention should be paid to factors such as temperature, time, environment, and method of the chip to ensure its quality and performance.

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