What does reliability testing chip DPA analysis include?

Date：2023-06-02 16:48:06Views：519

Reliability is a very important concept in the field of electronic equipment and device engineering, which refers to the ability of a device or device to maintain its performance and functionality within a specified service life. Reliability analysis can help evaluate the lifespan of machines under specific environmental and operating conditions, and help predict the probability of failure occurrence, thereby guiding how to optimize the design and manufacturing process of equipment. DPA (Constructive Physical Analysis) analysis is an important testing technique in reliability testing, which can help verify the reliability of chips.

DPA analysis can be divided into semi non-destructive testing and completely destructive testing. Semi non-destructive testing typically includes testing methods such as visual inspection, microscopic chromatography, microscopy, and elemental analysis, which can predict the lifespan and effectiveness of equipment by observing and analyzing small defects in chips. Complete destructive testing includes methods such as cutting, clamping, and tearing, which can damage the chip and conduct detailed analysis of its interior to obtain information on the failure mode, cause of failure, and compliance with design specifications of the device or device.

DPA analysis is commonly used in the design process of reliability testing chips, including the following aspects:

Appearance inspection: Inspect and evaluate the appearance defects of the equipment, such as cracks, scratches, solder joint quality, etc.

Microscopic examination: Microscopic examination of the device cross-section can observe the internal details of the chip, such as circuit, structure, solder joints, metal layers, etc.

Microscopic chromatography: Chemical or electrochemical corrosion treatment is performed on the chip, and the chip is checked for compliance with design specifications by observing characteristics such as material faults and small pores.

Element analysis: Analyzing the element composition in a chip through techniques such as spectral analysis or X-ray fluorescence analysis is beneficial for determining whether there are material issues and contamination issues during the processing of the chip.

Device parameter measurement: Measure the characteristic parameters of the device, such as resistance, capacitance, inductance, breakdown voltage, etc.

The above is the commonly used testing method for DPA analysis in reliability testing chips. DPA analysis can help detect material and manufacturing defects in devices, predict the lifespan and effectiveness of devices, and provide valuable feedback information to equipment manufacturers, thereby helping to improve the design and manufacturing process of equipment. Chuangxin Testing is a professional testing institution for electronic components. Currently, it mainly provides integrated circuit testing services such as capacitors, resistors, connectors, MCU, CPLD, FPGA, DSP, etc. Specializing in functional testing of electronic components, appearance testing of incoming electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components, and ROHS composition analysis testing. Welcome to call, we will be happy to serve you!