Application of X-ray in Circuit Board Testing

Date：2023-05-16 15:04:10Views：290

With the increasing complexity and high-performance requirements of electronic products, the design and manufacturing of circuit boards have become increasingly complex. Therefore, circuit board inspection has become a very important part of the production process. Traditional circuit board detection methods include visual inspection, electrical testing, and functional testing, but these methods have some drawbacks, such as low accuracy, low efficiency, and susceptibility to human errors. To help everyone gain a deeper understanding, the following content is organized by Chuangxin Testing Network and provided for your reference.

The principle of X-ray technology is to use X-ray transmission to detect faults and defects in circuit boards by analyzing the intensity and distribution of X-ray. This technology has the advantages of high resolution, high sensitivity, and high accuracy, which can effectively detect small faults and defects in circuit boards, thereby improving the yield and production efficiency of circuit boards.

Compared with traditional circuit board inspection methods, X-ray technology has higher accuracy and reliability because it can directly display the problem through images, avoiding the need for tedious manual inspection. In addition, X-ray technology can also achieve comprehensive inspection of circuit boards, including inspection of appearance, solder joints, circuits, components, and other aspects, further improving the quality of modern industrial manufacturing.

In circuit board detection, X-ray technology can be used in various application scenarios, such as:

Fault detection: X-ray technology can be used to detect faults in circuit boards, such as missing electronic components, short circuits, open circuits, etc.

Thickness measurement: X-ray technology can be used to measure the thickness of circuit boards in order to determine whether there is insufficient thickness or the position and shape of circuit board components.

Tomographic analysis: X-ray technology can be used to analyze the layer structure of circuit boards in order to determine whether there are problems in the design and manufacturing process of the circuit board.

Material and defect detection: X-ray technology can be used to detect materials and defects in circuit boards, such as metal chips, fractures, cracks, etc.

In practical applications, X-ray technology can effectively detect faults and defects in circuit boards, thereby improving the yield and production efficiency of circuit boards. Circuit board inspection based on X-ray technology has become an indispensable part of modern industrial manufacturing. With the continuous improvement and development of technology, X-ray technology will bring more efficient, accurate, and intelligent circuit board testing solutions, providing strong support for the development of the manufacturing industry.