What are the common damage detection methods for IC chips?

Date：2023-05-09 15:45:28Views：370

Integrated circuit (IC) chips are the core components of modern electronic products, and the detection of IC chips is becoming increasingly important. During the production and use of IC chips, it is easy to experience damage, which greatly affects the performance and lifespan of IC chips. Therefore, scientific and effective detection of IC chip damage is crucial for ensuring the quality and reliability of IC chips. The following introduces several common methods for IC chip damage detection.

Electrical characteristic testing

Electrical characteristic testing is one of the most common methods for IC chip damage detection. By measuring the electrical characteristic parameters of IC chips, such as current, voltage, resistance, etc., damage in IC chips can be identified. Some common electrical characteristic tests include leakage current testing, thermal decomposition testing, breakdown testing, etc. These tests can be automated through instruments and have high efficiency.

Visual inspection

Visual inspection is the process of observing the surface of a chip through visual inspection or microscopy to check for obvious damage or defects. Visual inspection usually includes the packaging, pins, surface coating layer, etc. of the chip.

Mechanical testing

Mechanical testing is the process of testing the mechanical properties of a chip, such as hardness, toughness, and fatigue strength, to check for serious damage or defects. Mechanical testing usually includes impact testing, bending testing, tensile testing, etc. of chips.

Infrared thermogram

Infrared thermal imaging is mainly used to capture the thermal image of the surface of IC chips through an infrared camera. Due to the loss of electronic energy in IC chips, local temperature increases can be observed, resulting in obvious hot spots on the thermal image. By analyzing the location and distribution of hotspots, damage to IC chips during production or operation can be identified. The advantage of infrared thermography detection is that it can be performed without the need for damage or disassembly of IC chips. However, due to the high cost of infrared thermal image detection technology, it is less applied in practice.

Thermal testing

Thermal testing is the process of testing the thermal performance of a chip, such as thermal conductivity, thermal expansion, thermal stability, etc., to check for serious damage or defects. Thermal test usually includes high temperature test, low temperature test, thermal shock test, etc.

failure analysis

Failure analysis is the process of analyzing the cause of chip failure to determine whether the chip has been damaged or requires further testing. Failure analysis usually includes chemical analysis, physical analysis, electrical analysis, etc. of chips.

Mechanical testing

Mechanical testing mainly tests IC chips through mechanical loads. Common mechanical loads include tension, compression, bending, etc. By analyzing the deformation and stress distribution of IC chips under different loads, it is possible to determine whether there are problems such as damage, cracks, displacement, etc. in the IC chip. The advantage of mechanical testing is that it can visually detect the damage and failure of IC chips, but the disadvantage is that it requires specialized equipment and technical support, resulting in higher costs.

X-ray testing

X-ray testing mainly detects IC chips through the process of X-ray transmission. By analyzing the absorption, scattering, diffraction and other phenomena of X-rays in IC chips, some damages in IC chips can be identified. The advantage of X-ray testing is that it can detect IC chips packaged inside the casing and metal damage that is difficult to detect. However, X-ray detection involves radiation issues and requires the use of expensive instruments, so it is rarely applied in practice.

The continuous updating and development of IC chip damage detection technology ensures the normal operation of the chip. By comprehensively adopting various detection methods, the quality and reliability of IC chips can be improved, providing strong support for the wide range of IC chip applications. Chuangxin Testing is a professional testing institution for electronic components. Currently, it mainly provides integrated circuit testing services such as capacitors, resistors, connectors, MCU, CPLD, FPGA, DSP, etc. Specializing in functional testing of electronic components, appearance testing of incoming electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components, and ROHS composition analysis testing. Welcome to call, we will be happy to serve you!