What are the commonly used non-destructive analysis and testing methods for IC?

Date：2023-04-21 15:03:15Views：437

With the rapid development of modern industry and the acceleration of urbanization, integrated circuits (ICs) have become the core components of modern electronic products, and their importance is self-evident. In order to ensure the quality and reliability of IC, non-destructive analysis and testing methods are essential. This article will introduce the commonly used non-destructive analysis and testing methods for ICs.

Visual inspection

Appearance inspection is a visual or manual inspection of the surface appearance and shape of an IC to determine whether there are defects or defects in the IC. This method is usually used to check for surface damage, scratches, bubbles, deformation, and other issues in ICs.

Magnetic Resonance Imaging (MRI)

Magnetic resonance imaging (MRI) is a non-destructive detection technique that can be used to detect internal faults and defects in ICs. MRI generates images of IC by placing it in a strong magnetic field and utilizing the phenomenon of nuclear magnetic resonance. This method can detect cracks, bubbles, short circuits, and other issues inside the IC.

Heat conduction test

Heat conduction test is to detect internal defects and faults of IC by measuring the temperature distribution of IC chip. This method is usually tested using a thermal imager or infrared thermal imager. By analyzing heat conduction test data, it can be determined whether there are faults and defects inside the IC.

Acoustic detection

Acoustic detection is a non-destructive detection technology that can be used to detect internal faults and defects in ICs. This method generates an image of the IC by sending sound waves to the IC and measuring the propagation speed and attenuation degree of the sound waves. This method can detect cracks, bubbles, short circuits, and other issues inside the IC.

X-ray testing

X-ray testing is a non-destructive testing technique that can be used to detect internal faults and defects in ICs. This method generates an image of the IC by sending X-rays to the IC and measuring the attenuation of the X-rays. This method can detect cracks, bubbles, short circuits, and other issues inside the IC.

The above are the commonly used non-destructive analysis and testing methods for IC. These technologies can effectively detect internal defects and faults in ICs, helping to improve the quality and reliability of ICs. Our company has a team of professional engineers and industry elites, with three standardized laboratories covering an area of over 1800 square meters. We can undertake various testing projects such as electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, functional testing, factory incoming material inspection, and tape weaving.