How to inspect electronic chips for surface defects?

Date：2023-04-04 14:54:14Views：370

In the manufacturing process of electronic chips, chip surface defect detection is a crucial step. The presence of surface defects on chips may lead to a decrease in chip performance, affecting their lifespan and reliability. Therefore, defect detection on the surface of chips is an indispensable part of electronic chip quality inspection.

Generally speaking, chip surface defects mainly include the following types: oxide skin, stains, pits, cracks, bubbles, etc. Different detection methods and techniques can be used to address these defects.

Traditional methods for detecting surface defects on chips include visual inspection and microscopic examination. These methods can detect some obvious defects, but for small defects, they may be missed. In order to improve the sensitivity and accuracy of defect detection, modern electronic chip manufacturing processes have adopted some advanced detection technologies.

Among them, infrared imaging technology can detect surface defects by detecting the heat distribution on the chip surface, which has the advantages of fast detection speed and wide detection range. X-ray detection technology can detect surface defects by detecting the transmittance of the chip surface, and has the advantages of high detection sensitivity and high degree of automation. Laser scanning technology can detect defects by scanning the surface of chips, which has the advantages of fast detection speed and high detection accuracy. These technologies require professional equipment and technical support, but can effectively improve the accuracy and efficiency of defect detection.

In addition to the aforementioned technologies, more efficient and accurate defect detection solutions can also be developed by combining artificial intelligence and machine learning technologies. For example, deep learning algorithms can be used to train a large number of chip surface images to achieve automated defect detection. This method has the advantages of fast detection speed and high accuracy, while also avoiding the influence of human factors on the detection results.

In summary, the detection of chip surface defects is an indispensable part of the electronic chip manufacturing process. Different detection methods and techniques can be selected for different types of defects. In the future, with the continuous development of technologies such as artificial intelligence and machine learning, defect detection technology will also be continuously improved and improved. Our company has a team of professional engineers and industry elites, with three standardized laboratories covering an area of over 1800 square meters. We can undertake various testing projects such as electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, functional testing, factory incoming material inspection, and tape weaving.