Chip testing process and methods Third-party professional testing

Date：2023-03-31 14:49:45Views：774

As an important component of modern electronic equipment, the stability of chip quality and performance has a decisive impact on the reliability of the entire system. Therefore, strict quality control and testing are required during production and use. This article will introduce the chip detection process and methods.

1、 Chip detection process

The chip testing process mainly includes three steps: pre process testing, post process testing, and pre shipment testing.

1. Pre process inspection

Pre process detection mainly refers to the detection of various parameters of a chip in various processes during the chip manufacturing process. It includes multiple processes such as wafer preparation, mask photolithography, etching, diffusion, annealing, and chemical mechanical polishing. Each process requires corresponding parameter testing of the chip to ensure that the quality and performance of the chip meet requirements. The main test items include wafer surface topography, transistor electrical parameters, and MOS gate quality.

2. Post process inspection

Post process testing mainly refers to the testing of various parameters of a chip during the final steps of the chip manufacturing process. It includes multiple processes such as gluing, cutting, polishing, film deposition, and metallization. Each process requires corresponding parameter testing of the chip to ensure that the quality and performance of the chip meet requirements. The main test items include wire width, wire spacing, and wire layer uniformity.

3. Pre shipment inspection

Pre shipment inspection refers to the final inspection conducted after the completion of chip production. The main task is to comprehensively test various parameters of the chip to ensure that the quality and performance of the chip meet the requirements. The main test items include electrical parameters, packaging quality, reliability, etc.

2、 Chip detection methods

The detection methods for chips mainly include physical detection and electrical detection.

1. Physical testing

Physical testing is to determine whether the quality and performance of a chip meet requirements by observing the physical characteristics of the chip. The main physical testing methods include optical microscopy, scanning electron microscopy, atomic force microscopy, and X-ray diffraction testing.

Optical microscope testing is mainly used to observe the morphology, pattern, and structure of the chip surface, including crystal defects, contamination, wear, and scratches. Scanning electron microscope inspection can observe higher resolution chip surface details, including crystal defects, crystal structure, circuit morphology, and so on. Atomic force microscopy (AFM) testing can provide more detailed detection of the morphology and structure of the chip surface, such as observing the atomic level details of the crystal lattice and surface morphology. X-ray diffraction testing can be used to analyze the structure and properties of chip crystals, including surface crystallinity, impurity content, and so on.

2. Electrical testing

Electrical testing is a test of the electrical characteristics of a chip to determine whether the quality and performance of the chip meet requirements. The main electrical testing methods include IV testing, CV testing, high-frequency parameter testing, power consumption testing, and so on.

The IV test refers to determining the performance of various devices in a chip by measuring the current voltage characteristics of the chip. CV testing refers to measuring the capacitance voltage characteristics of a chip to determine the quality of the MOS structure in the chip. High frequency parameter testing refers to determining the performance of a chip in high frequency applications by measuring its high frequency characteristics, such as S parameters. Power consumption testing is to determine the power consumption performance of a chip by measuring its power consumption level under normal operating conditions.

In summary, the chip detection process and methods are of great significance for the manufacturing and use of chips. Only in a rigorous testing process can the quality and performance of the chip be ensured to meet the requirements, and have sufficient reliability to support the stable operation of various electronic devices. Chuangxin Testing is a professional testing agency for electronic components. Currently, it mainly provides integrated circuit testing services such as capacitors, resistors, connectors, MCU, CPLD, FPGA, DSP, etc. Specializing in functional testing of electronic components, incoming appearance testing of electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components, and ROHS component analysis and testing. Welcome to call, we will wholeheartedly serve you!