How to do chip slice analysis? Chip testing technology

Date：2023-03-28 15:16:45Views：568

Chip testing technology refers to various technologies and methods used to test and evaluate chips. Generally, chip testing technology involves test equipment, test procedures, test methods, and test data analysis. Its main purpose is to ensure that the performance and reliability of the chip meet the expected requirements. Chip slice analysis is a very important method of chip analysis, which can provide valuable information and data for chip design and manufacturing.

Chip slice analysis is mainly used to analyze the internal structure and composition of a chip, and evaluate the performance and reliability of the chip. The following are the general steps for chip slice analysis:

Slicing: First, the chip is cut, usually using precision electronic ion cutting or chemical mechanical polishing techniques to obtain a series of thin slices.

Observation: Place the cut sheet under a microscope and observe and analyze the internal structure and composition of the chip, such as the shape of transistors, the layout of metal wires, and the heat dissipation structure.

Optical microscope and scanning electron microscope (SEM): Use optical microscope and scanning electron microscope to observe and analyze the fine structure and surface morphology of the chip.

Analysis: By analyzing the composition and structure of the chip, understand the operating principle and performance characteristics of the chip, and evaluate the reliability and stability of the chip.

Report: Summarize and summarize the analysis results of the chip, and write an analysis report for subsequent design and manufacturing work.

Chip testing technology plays a very important role in chip design and manufacturing. By testing the chip, you can evaluate the performance characteristics of the chip, identify potential issues and defects, and make corrections and improvements. At the same time, test data can also be used to verify and improve chip design, improving chip reliability and stability. Our company has a team of professional engineers and industry elites, and has three standardized laboratories with an area of over 1800 square meters. It can undertake various testing projects such as electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, functional testing, factory incoming material inspection, and tape weaving.