Why does the chip oxidize? What should I do if I'm oxidized?

Date：2023-03-24 13:33:37Views：1723

Oxidation of chips is a common problem, as oxidation can damage the insulating layer on the chip surface, leading to chip performance degradation or failure. This is mainly caused by the oxidation reaction between the material on the chip surface and oxygen (O2) under conditions such as high temperature and high humidity. In order to enhance everyone's understanding of oxidation, the following is the content related to chip oxidation organized by the editor, hoping to provide you with reference and assistance.

Cause Analysis of Chip Oxidation

Generally, the materials on the surface of a chip are silicon (Si), silicon oxide (SiO2), aluminum oxide (Al2O3), etc. These materials are prone to react with oxygen under high temperature and humidity to form an oxide layer.

This oxidation reaction is a natural phenomenon because there is a certain energy difference between the chip surface material and the oxygen molecules in the surrounding environment. When the chip surface is affected by high temperature, humidity, and other factors, oxygen molecules will enter the chip surface and react chemically with the surface material to form an oxide layer.

Chip oxidation can damage the insulating layer on the chip surface, leading to chip performance degradation or failure. Therefore, a series of measures need to be taken to reduce the occurrence of chip oxidation during the chip manufacturing process, such as controlling temperature, humidity, and other conditions during the manufacturing process, using special materials to protect the chip surface, and strengthening maintenance during chip use.

Methods for processing chip oxidation

Cleaning: When the oxidation of the chip is relatively light, the oxide layer on the surface can be removed by cleaning. Generally, organic solvents, acid or alkali solutions such as acetone, isopropanol, methanol, hydrochloric acid, nitric acid, etc. are used for cleaning. However, it should be noted that after cleaning, it should be dried in a timely manner to avoid being affected by moisture again.

Chemical Mechanical Polishing: For severe oxidation, chemical mechanical polishing (CMP) can be used to remove the oxide layer from the surface through friction and chemical action. This method requires the use of specific chemicals and abrasives, as well as the control of polishing time and pressure to avoid damage to the chip.

Hydrofluoric acid treatment: Hydrofluoric acid can effectively remove the oxide layer on the chip surface. However, this method requires extremely high operating skills and precautions, as hydrofluoric acid is a very strong acid that poses great harm to both the human body and the environment.

Protection: In addition to treating oxidation, preventive measures can also be taken to reduce the occurrence of oxidation. Generally speaking, the chip surface can be protected by covering it with an oxide layer or other protective layer to reduce the occurrence of oxidation. In addition, conditions such as temperature and humidity can be controlled to avoid moisture and oxidation on the chip surface.

It should be noted that when processing chip oxidation, it is necessary to follow relevant safety operating procedures and select appropriate processing methods based on the specific situation of the chip to avoid causing greater damage to the chip.

The above is the "chip oxidation" related content brought about by this core breaking test. I hope it can be helpful to everyone. We will bring more exciting content later. The company's testing services cover a variety of testing projects, including electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, functional testing, factory incoming material inspection, and tape weaving. Welcome to call Chuangxin Testing, and we will wholeheartedly serve you.