What are the inspection principles and requirements for IC appearance inspection?

Date：2023-03-22 15:12:34Views：322

IC appearance detection is a process of detecting the external characteristics, markings, dimensions, etc. of a chip, and is also an important means to ensure IC quality and performance. Manual inspection and automated inspection have their respective advantages and disadvantages, and appropriate methods are selected for IC appearance inspection based on specific needs. To help you gain an in-depth understanding, the following content is organized by Chuangxin Testing Network for your reference.

The principle of IC appearance detection is based on computer vision and image processing technology. Through preprocessing, feature extraction, and matching operations on IC appearance images, automatic detection of IC appearance is achieved. Specifically, IC appearance testing is usually divided into the following steps:

Image acquisition: Use devices such as cameras to take photos or video recordings of the IC to be detected to obtain an appearance image of the IC.

Image preprocessing: Pre-processing an image, including operations such as denoising, enhancing contrast, graying, and binarization, to make the image more suitable for subsequent feature extraction and recognition.

Feature extraction: Extract features from the IC appearance image through image processing algorithms, such as the shape, identification, size, etc. of the chip.

Feature matching: matching the extracted features with the preset features to determine whether the IC meets the standards, such as whether there are defects, deviations, etc.

Determination Result: Determine the eligibility of the IC based on the matching result. If the IC meets the requirements, the next step can be performed; If the requirements are not met, subsequent processing such as scrapping or rework is required.

IC testing has very strict requirements for appearance, as the appearance of an IC may directly affect its performance and reliability. An IC can only be considered as a qualified product if it meets certain appearance requirements.

The appearance requirements for IC testing usually include the following aspects:

Clear identification: The identification on the IC should be clear and visible, without blurring, damage, missing printing, etc. Identification is an important basis for distinguishing IC models and batches. Clear identification can improve the accuracy and efficiency of IC testing.

No damage: The appearance of the IC should be intact, without scratches, cracks, deformation, etc. Damage may affect the performance and reliability of an IC, and may even lead to IC failure.

Accurate dimensions: The overall dimensions of the IC should be accurate and meet design requirements. Dimensional deviations may cause the IC to not work properly or not match other devices.

No foreign matters: The exterior of the IC should be free of impurities and foreign matters. External impurities may affect the packaging density and heat dissipation performance of ICs, thereby affecting the performance and lifespan of ICs.

Surface flatness: The surface of the IC should be flat and smooth, without bulges, dents, and other conditions. Uneven surfaces may affect the packaging density and heat dissipation performance of ICs, thereby affecting the performance and lifespan of ICs.

The above is about the testing principles and requirements of IC appearance testing organized by the Core Creation Testing Team. I hope it can be helpful to you. Our company has a team of professional engineers and industry elites, and has three standardized laboratories with an area of over 1800 square meters. It can undertake various testing projects such as electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, functional testing, factory incoming material inspection, and tape weaving.