What is the process of IC appearance defect detection scheme for chip defect detection?

Date：2023-03-22 15:06:59Views：421

Appearance defect detection of electronic components is very important because these products are usually small in size and have high quality requirements, making it difficult to pass manual batch testing. At the same time, due to the small size and high accuracy of chips, appearance testing has always been a pain point in the industry, and still requires a lot of manual testing. In order to enhance everyone's understanding of chip defect detection, the following is the relevant content of the IC appearance defect detection scheme process compiled by the editor, hoping to provide you with reference and assistance.

The IC appearance defect detection scheme usually includes the following steps:

Image acquisition

Obtain the appearance image of the IC to be tested through devices such as a camera. Image acquisition requires clear image quality, uniform light, and appropriate angles to avoid interference from factors such as occlusion and reflection.

image processing

Perform preprocessing on the acquired IC appearance image, including removing background interference, smoothing filtering, image enhancement, and other operations. Pre processing can improve image quality and make subsequent detection more accurate.

feature extraction

Extracts IC features from the pre processed image, including identification, appearance, size, and other features. Feature extraction requires a deep understanding of IC features and a certain proficiency in image processing algorithms to improve the accuracy and efficiency of feature extraction.

Feature matching

Compare the extracted IC features with known standards to determine whether the IC has defects. Feature matching requires the establishment of a complete database, including various types of IC features and corresponding standards, to improve the accuracy and coverage of matching.

Defect classification

Classify the detected IC defects, including surface defects, dimensional deviations, identification errors, etc., for subsequent processing and statistical analysis.

In summary, the IC appearance defect detection scheme needs to rely on advanced image processing technology and algorithms, combined with rich IC database and experience knowledge, to be able to efficiently and accurately detect IC appearance defects, ensuring the quality and reliability of IC products. Our company has a team of professional engineers and industry elites, and has three standardized laboratories with an area of over 1800 square meters. It can undertake various testing projects such as electronic component testing and verification, IC authenticity identification, product design and material selection, failure analysis, functional testing, factory incoming material inspection, and tape weaving.