What items are mainly tested in the reliability test of optoelectronic components?

Date：2023-02-01 18:15:38Views：504

The detection of optoelectronic components is an essential basic work. How to accurately and effectively detect the relevant parameters of components and determine whether the components are normal depends on different methods to determine whether the components are normal. Among them, there are many types of products that need to be tested for reliability, and different enterprises will have different testing requirements according to different requirements. This article has collected and collated some materials, hoping to be of great reference value to all readers.

Physical characteristics test items of optoelectronic components:

1. Internal water vapor: determine the water vapor content in the gas inside the metal or ceramic packaged optoelectronic devices.

2. Tightness: determine the airtightness of optoelectronic device package with inner cavity.

3. ESD wide value: determine the sensitivity and sensitivity of optoelectronic devices to damage and degradation caused by electrostatic discharge.

4. Flammability: determine the flammability of materials used in optoelectronic devices.

5. Shear force: determine the integrity of the materials and processes used to install the chips and passive components of optoelectronic devices on the tube base or other substrates.

6. Solderability: determine the solderability of optoelectronic device leads (leads with diameter less than 30175mm and flat leads with equivalent cross-sectional area) to be welded.

7. Lead bonding strength: determine the lead bonding strength of optoelectronic devices using low temperature welding, hot pressure welding, ultrasonic welding and other technologies.

Mechanical integrity test items of optoelectronic components:

1. Mechanical impact: determine whether optoelectronic devices can be used in electronic equipment subject to moderate severe impact. The impact may be caused by sudden force or violent vibration during loading, unloading, transportation or on-site use.

2. Variable frequency vibration: determine the impact of vibration on various components of optoelectronic devices within the standard frequency range.

3. Thermal shock: determine the resistance and effect of optoelectronic devices when they are subjected to drastic temperature changes.

4. Plug-in and pull-out durability: determine whether the insertion and pull-out of optical fiber connectors of optoelectronic devices, optical power, loss, reflection and other parameters meet the repeatability requirements.

5. Storage test: determine whether optoelectronic devices can withstand transportation and storage at high and low temperatures.

6. Temperature cycle: determine the ability of optoelectronic devices to withstand extremely high and extremely low temperatures, and the impact of alternating changes of extremely high and extremely low temperatures on optoelectronic devices.

7. Constant humidity and heat: determine whether sealed and unsealed optoelectronic devices can withstand the specified temperature and humidity at the same time.

8. High temperature life: determine the failure mechanism and working life of optoelectronic devices under high temperature accelerated aging.

Accelerated aging test of optoelectronic components:

Apply high temperature, high humidity and certain driving current to optoelectronic devices to accelerate aging. According to the test results, the optoelectronic devices can be judged to have functions and lose functions, as well as receive and reject, and the working conditions of optoelectronic devices can be adjusted and the reliability can be calculated.

1. High temperature accelerated aging: the most basic environmental stress type high temperature during accelerated aging. During the experiment, the selected parameters should be monitored regularly until the degradation exceeds the end of life.

2. Constant temperature test: the constant temperature test is similar to the high temperature operation test, and the number of constant temperature test samples and the allowable number of failures shall be specified.

3. Variable-temperature test: The high-temperature accelerated aging test with variable temperature is to gradually increase the temperature (for example, 60 ℃, 85 ℃ and 100 ℃) periodically and in sequence.

4. Temperature cycle: in addition to the temperature cycle of optoelectronic devices as an environmental stress test, the temperature cycle can also accelerate the aging of tube electronic devices.

The purpose of accelerated aging of temperature cycle is not to cause degradation of specific performance parameters, but to provide additional instructions for long-term mechanical stability of optical path encapsulated in the module.

The above is the relevant content of the reliability test of optoelectronic components compiled by Chuangxin Testing. I hope it can help you. Chuangxin Testing is a professional testing agency for electronic components. At present, it mainly provides integrated circuit testing services such as capacitance, resistance, connector, MCU, CPLD, FPGA, DSP, etc. Specializing in functional testing of electronic components, appearance testing of incoming materials of electronic components, anatomical testing of electronic components, acetone testing, X-ray scanning testing of electronic components, ROHS component analysis and testing. Welcome to call, we will serve you wholeheartedly!