What are the common failure stages of electronic components?

Date：2022-12-20 15:00:27Views：931

In the early failure stage, defective, contaminated or critical electronic components will fail and be exposed during this period. This stage is very short. Some components will become invalid in only a few days and will be eliminated early. The normal failure period is the normal working stage of components and is also the life span of components. This paper collects and sorts out some materials, hoping to be of great reference value to all readers.

The failure of a large number of similar components can be divided into three stages:

1) Early failure period

Newly manufactured electronic devices, which have just been put into use for a period of time, are called early failure. Early failure is characterized by high failure rate, but it decreases rapidly with the increase of working time. Some of the failure reasons in this section are caused by defects in the raw materials used to manufacture devices; Some are caused by improper process measures during the production of components.

In general, early failure is a potential failure hidden in the design and manufacturing of components. It will continue to deteriorate in use, and the failure will be caused by the exposure of faults. Therefore, the early failure of components is very harmful to users. During the production process of the whole machine, the main purpose of aging screening of the element is to accelerate the early failure, so that the whole machine can enter the normal use stage before leaving the factory, screen out the components that fail early, and ensure the reliable operation of the whole machine.

2) Accidental expiration

After the early failure of electronic components, they enter the accidental failure period. This stage is characterized by low and stable failure rate, which is accidental. This is the best working stage of components. Because of the long service life, it is also called the service life. The accidental failure of a good integrated circuit can exceed one million hours.

The failure cause during this period can be seen as that the stress accumulated by the components at a certain time (refers to various factors that affect the function of the components, such as temperature, voltage, current and mechanical stress) exceeds the strength of the components against these stresses. Generally, there are the following three situations: the lead is broken due to sudden mechanical shock or thermal shock; Damage of junction caused by large current; The environmental change exceeds the scope of application, which makes the component characteristics change too much to work, or even fail.

For the above situations, the circuit design should be carried out from the worst case, taking into account the possible range of changes in component parameters, and considering some specific measures, such as heat dissipation and ventilation measures and anti electromagnetic interference measures, to avoid environmental changes beyond the scope of application.

3) Loss failure period

After the components are used normally, due to aging, loss, wear and fatigue, the failure rate increases with the increase of working time. This stage is called loss failure period, also called late failure period.

The loss failure is mainly caused by the chemical and physical changes of the material. For example, the surface of the lead bonding point inside the tube is oxidized for a long time and the surface oxidation increases the resistance, leading to excessive heat and opening the bonding point; Another example is the surface chemical reaction, which changes the distribution of electron holes, generates an inversion layer, forms conductive channels, increases the reverse current, worsens the parameters, and causes device failure. Loss failure is a normal natural law, indicating that the components have reached the rated service life, and the measures taken for this are regular replacement.

The above contents are related to the common failure stages of electronic components compiled by the wound core detection team. I hope they can help you. Chuangxin Testing is a professional testing agency for electronic components. At present, it mainly provides integrated circuit testing services such as capacitance, resistance, connector, MCU, CPLD, FPGA, DSP, etc. Specializing in electronic component function testing, electronic component incoming appearance testing, electronic component dissection testing, acetone testing, electronic component X-ray scanning testing, ROHS component analysis testing. Welcome to call, we will serve you wholeheartedly!