The importance of aging test for electronic components

Date：2022-11-30 15:28:00Views：673

In the production and manufacturing process of PCB circuit boards and components, it is particularly important to improve the production efficiency and yield rate of chip processing. It can reduce the production of finished products for enterprises and improve the economic benefits of enterprises. The purpose of aging test is to use laboratory equipment to simulate the change of insulation performance of insulating materials under long-term operation in the shortest time. Therefore, scientists from foreign experimental research departments have done a lot of research and experimental exploration, and finally determined the experimental method of simulated accelerated aging of insulating materials.

The accelerated aging is to accelerate the completion of the experiment by artificially accelerating the aging of insulating materials in the laboratory. A better experimental method of artificial accelerated aging must have equivalence, typicality and repeatability, of which equivalence is often the most important, because equivalence can truly reflect the aging process of insulating materials.

How to improve the production efficiency and yield requires us to test the weldability of smt patch processing before putting into mass production. At this time, we need to aging the samples for testing pcb prototypes. Because the solderability of newly produced components or PCB is generally not a problem, but it will deteriorate due to oxidation after being stored for a period of time. The test must consider the impact of normal storage conditions on solderability.

It is found that the suitability of a technology depends on the metal properties of the weld end coating and the expected causes of product quality degradation. In the pcb electronics manufacturing industry, components and pcbs often require a certain shelf life, usually 6-12 months. Therefore, it is obviously impractical to wait for this period before measuring, so accelerated storage aging method must be adopted. The most commonly used test equipment is high-pressure accelerated aging test chamber.

Through the special research on accelerated aging, including the testing technology of humid and thermal conditions from 1h steam aging to one month or several months. Oxidation is the main reason for tin alloy, while diffusion is the main reason for precious metal coating. The common practice in the electronic manufacturing industry is to use 8~24h steam aging for tin alloy; For the coating whose quality is reduced mainly due to diffusion, dry heat aging at 115 ℃ for 16h is adopted; Steam aging is used for coatings whose quality degradation mechanism is unknown.

After taking some aging measures to reduce the welding quality caused by different factors, it can not only ensure the smooth processing of SMT, but also ensure the straight rate of PCBA processing, so as to improve the production efficiency and yield rate of chip processing.

The above is related to the aging test of electronic components compiled by the Chuang Xin Testing Department. I hope it will be helpful to you. Our company has a team of professional engineers and industry elites, and has built three standardized laboratories with an area of more than 1800 square meters, which can undertake a variety of test projects such as electronic component test verification, IC authenticity identification, product design material selection, failure analysis, functional testing, factory incoming material inspection and tape weaving.