What are the structure and application scope of X-ray testing equipment?

Date：2022-11-30 15:25:28Views：494

X-ray detection technology is a new process method and analysis technology, which can complete the product defect detection that cannot be seen by the naked eye, and achieve 100% nondestructive testing, that is, it can accurately detect the internal problems of the product without causing any damage to the product. X-ray detection, with its unique advantages, has successfully attracted the attention of various industrial industries and is widely used in production lines. X-ray detection equipment is a detection method that uses low-energy X-ray to quickly detect the internal quality and foreign matters of the object to be detected, and displays the image of the object to be detected through the computer.

Structural composition of x-ray testing equipment

1. X-ray tube

This is the core part of the x-ray detector. It generates X-ray, penetrates the interior of the object to detect the internal defects of the product.

2. Flat panel detector

This device can capture the X-ray produced by the X-ray tube and convert it into a picture, so that the user can see the problems of the tested object intuitively.

3. Mechanical structure

This part plays the role of supporting equipment, and determines the range and convenience of the x-ray detector.

4. Software computer control system

Software manipulation is the core of the x-ray detector. A good software manipulation system has the functions of enhancing the image and actively determining defects.

5. The lead plate protection and various safety protection mechanisms X-ray has certain radiation risks, so the x-ray testing equipment is equipped with lead plate protection to prevent x-ray leakage. At the same time, the equipment has three color indicator lights, emergency stop and other safety mechanisms.

Application scope of X-ray detection technology

Which products can be tested with x-ray? SMT, metal castings, aerospace accessories, semiconductor chips, etc. For electronic components, X-ray can check the categories of IC chips, PCB printed circuit boards, PCBA/SMT/BGA spot welding, lithium batteries, IGBT semiconductors, and LED/LCD. X-ray can be used for internal inspection of hardware castings, welds, cracks, auto parts, pressure vessels, pipes, etc.

In addition, x-ray plastic materials and components, electronic components, LED inspection elements and other internal cracks, insufficient foreign matters, BGA, internal displacement analysis, such as empty welding, faulty welding, etc; BGA welding defects, internal conditions of microelectronic systems and sealing elements, cables, fittings and plastic parts.

X-ray inspection has many products and the inspection principle is the same. Take the inspection of cavities as an example: when welding BGA components, there will inevitably be gaps. These defects are hollow BGA spot welding, which will reduce the mechanical strength of spot welding, affect the stability and service life of spot welding. Therefore, it is necessary to control the generation of gaps.

In the quality standard of spot welding, clearance plays a decisive role in quality, especially in large spot welding. The spot welding area can reach 25 square centimeters, and it is difficult to control the change of enclosed gas in the cavity. The common result is that the size and location of the gap in the solder are different. In terms of heat transfer, gaps can lead to module failure, even damage during normal operation. Therefore, quality control is absolutely required in the production process.

X-ray inspection has the function of high-definition image and defect analysis. There is also sufficient magnification to enable producers to easily view detailed product defects to meet current and future needs.

The above is about the organization composition and application scope of the X-ray detection equipment organized by the wound core detection department. I hope it will be helpful to you. Our company has a team of professional engineers and industry elites, and has built three standardized laboratories with an area of more than 1800 square meters, which can undertake a variety of test projects such as electronic component test verification, IC authenticity identification, product design material selection, failure analysis, functional testing, factory incoming material inspection and tape weaving.