Common screening items of electronic components!

Date：2022-11-11 14:35:08Views：522

The inherent reliability of electronic components depends on the reliability design of products. Therefore, before the electronic components are installed on the whole machine and equipment, the components with early failure should be eliminated as much as possible. Therefore, the components should be screened. What are the common screening items for electronic components? Next, we will briefly introduce the common screening items of electronic components. Let's have a look!

Common screening items of electronic components

High temperature storage

The failure of electronic components is mostly caused by various physical and chemical changes in the body and surface, which are closely related to temperature. After the temperature rises, the chemical reaction speed is greatly accelerated, and the failure process is also accelerated. The defective components can be exposed in time and eliminated.

High temperature screening is widely used in semiconductor devices. It can effectively remove devices with surface contamination, poor bonding, oxide defects and other failure mechanisms. It is usually stored at the highest junction temperature for 24-168 hours.

High temperature screening is simple and inexpensive, and can be implemented on many components. After high temperature storage, the parameter performance of components can be stabilized and the parameter drift in use can be reduced. The thermal stress and screening time of various components should be properly selected to avoid new failure mechanisms.

Power electric aging

During screening, under the combined effect of thermoelectric stress, a variety of potential defects in the body and surface of components can be well exposed, which is an important item of reliability screening.

Various electronic components are usually aged for several hours to 168 hours under rated power. Some products, such as integrated circuits, cannot change the conditions at will, but can use high-temperature working mode to improve the working junction temperature to reach a high stress state. The electrical stress of various components should be appropriately selected, which can be equal to or slightly higher than the rated conditions, but can not introduce new failure mechanisms.

Power aging requires special test equipment, which is expensive, so the screening time should not be too long. It usually takes several hours for civilian products, 100 or 168 hours for military highly reliable products, and 240 hours or even longer for aerospace grade components.

Temperature cycle

Electronic products will encounter different environmental temperature conditions during use. Under the stress of thermal expansion and cold contraction, components with poor thermal matching performance are prone to failure. The temperature cycle screening utilizes the thermal expansion and contraction stress between extreme high temperature and extreme low temperature, which can effectively eliminate products with thermal performance defects. The commonly used screening conditions for components are - 55~+125 ℃ and 5~10 cycles.

Centrifugal acceleration

Centrifugal acceleration test is also called constant stress acceleration test. This screening is usually carried out on semiconductor devices. The centrifugal force generated by high-speed rotation is applied to the devices, which can eliminate the devices with too weak bonding strength, poor internal lead matching and poor mounting. Generally, 20000 g centrifugal acceleration is selected to continue the test for one minute.

Monitoring vibration and shock

Monitoring the electrical performance while conducting vibration or impact tests on products is often referred to as monitoring vibration or monitoring impact tests. This test can simulate the vibration and impact environment during the use of the product, and can effectively eliminate the components with poor mechanical structure such as transient short circuit and open circuit, as well as the faulty soldering in the whole machine. Monitoring vibration and shock is an important screening item in highly reliable relays, connectors and military electronic equipment.

The typical vibration conditions are: frequency 20~2000 Hz, acceleration 2~20 g, scanning 1~2 cycles, and staying near the resonance point for an additional period of time. The typical impact screening condition is 1500 ^ - 3000g, impact 3~5 times, and this test is only applicable to components.

Monitoring vibration and impact requires special test equipment, which is expensive and generally not used in civil electronic products.

In addition to the above screening items, the common ones are coarse and fine leak detection, microscopic inspection, linear discrimination screening, precision screening, etc.

The above is related to the common screening items of electronic components compiled by the core creation detection team, and I hope it will be helpful to you. Our company has a team of professional engineers and industry elites, and has built three standardized laboratories with an area of more than 1800 square meters, which can undertake a variety of test projects such as electronic component test verification, IC authenticity identification, product design material selection, failure analysis, functional testing, factory incoming material inspection and tape weaving.