Summary of problems in X-ray weld inspection of electronic components

Date：2022-10-28 16:15:02Views：717

With the progress of science and technology, the circuit board is filled with smaller and smaller components, and the solder joint detection is also required to ensure the normal operation of the circuit board when welding is carried out by machine or manual. X-ray makes use of the penetrability of X-rays. Because of its short wave length and large energy, it can easily penetrate the tested materials. When the X-rays penetrate materials and do not penetrate materials to form differences, the materials with different densities can be distinguished by using the property of differential absorption.

X-ray inspection technology is a mature key process inspection and control technology in SMT manufacturing industry, which greatly improves the confidence in the quality of finished products. X-ray can be used to image the solder joints of electronic components with high resolution on the computer, and simple software settings can be used to determine the welding defects, and the following components with welding problems can be screened out. At the same time, X-ray electronic component testing equipment can be added to the production line to further improve the testing efficiency.

1. Continuous welding: solders between adjacent solder joints are connected together

2. False soldering: the component pin is not wetted by solder, and the bonding pad is not wetted by solder

3. Empty soldering: all insertion holes of base material components are exposed, and component pins and pads are not wetted by solder

4. Semi soldering: the pins and pads of components have been wetted, but the insertion holes are still partially exposed

5. Tin: Solder contact element body or sealing end at pin bending

6. Wrapping soldering: too much soldering tin makes it impossible to see the element legs, even the edges and corners of the element legs can not be seen

7. Tin bead and tin slag: tin slag with too large diameter and length sticks to the surface of the base plate

8. Little tin and thin tin: the metal hole of the double-sided plate is not completely wetted by the solder

9. Tin tip: the tin layer on the component pin head or circuit board is pulled out in a sharp shape

10. Tin crack: there is a crack between solder joint and pin, or between solder pad and solder joint or solder joint itself

11. Pinholes, cavities and air holes: There are pinholes or holes of different sizes inside the solder joint

12. Pad warping: the separation between wire, pad and base material is greater than the pad thickness

13. Broken copper foil: the copper foil is disconnected on the circuit board

14. Cold welding: the surface of the welding spot is not smooth, with burrs or particles

To sum up, X-ray testing equipment has a series of advantages such as nondestructive, easy to use, and high testing accuracy. The internal state of electronic components can be well detected through the detection equipment, and even the angle, current, voltage and image of electronic equipment can be detected. Chuangxin Testing is a professional testing agency for electronic components. At present, it mainly provides integrated circuit testing services such as capacitance, resistance, connector, MCU, CPLD, FPGA, DSP, etc. Specializing in electronic component function testing, electronic component incoming appearance testing, electronic component dissection testing, acetone testing, electronic component X-ray scanning testing, ROHS component analysis testing. Welcome to call, we will serve you wholeheartedly!